Journal of Semiconductors, Volume. 43, Issue 10, 102501(2022)

Integration of high-performance spin-orbit torque MRAM devices by 200-mm-wafer manufacturing platform

Hongchao Zhang1, Xiangyue Ma1, Chuanpeng Jiang1, Jialiang Yin1, Shuqin Lyu2, Shiyang Lu2, Xiantao Shang2, Bowen Man2, Cong Zhang2, Dandan Li2, Shuhui Li2, Wenjing Chen3, Hongxi Liu2、*, Gefei Wang2、**, Kaihua Cao1,3、***, Zhaohao Wang1, and Weisheng Zhao1,3
Author Affiliations
  • 1Fert Beijing Institute, School of Integrated Science and Engineering, Beihang University, Beijing 100191, China
  • 2Truth Memory Tech. Corporation, Beijing 100088, China
  • 3Beihang-Goertek Joint Microelectronics Institute, Qingdao Research Institute, Beihang University, Qingdao 266000, China
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    References(50)

    [4] H L Chiang, J F Wang, T C Chen et al. Cold MRAM as a density booster for embedded NVM in advanced technology. 2021 Symposium on VLSI Technology, 1(2021).

    [19] J Li, C Augustine, S Salahuddin et al. Modeling of failure probability and statistical design of spin-torque transfer magnetic random access memory (STT MRAM) array for yield enhancement. 2008 45th ACM/IEEE Design Automation Conference, 278(2008).

    [27] S Couet, S Rao, S Van Beek et al. BEOL compatible high retention perpendicular SOT-MRAM device for SRAM replacement and machine learning. 2021 Symposium on VLSI Technology, 1(2021).

    [33] [33] Embedded Memories Technology scaling & STT-MRAM for IoT & Automotive. IEEE International Electron Devices Meeting Archive, 2017

    [44] [44] JC-14 Quality and reliability of solid state products. Avilable from:https://www. jedec. org/committees/jc-14

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    Hongchao Zhang, Xiangyue Ma, Chuanpeng Jiang, Jialiang Yin, Shuqin Lyu, Shiyang Lu, Xiantao Shang, Bowen Man, Cong Zhang, Dandan Li, Shuhui Li, Wenjing Chen, Hongxi Liu, Gefei Wang, Kaihua Cao, Zhaohao Wang, Weisheng Zhao. Integration of high-performance spin-orbit torque MRAM devices by 200-mm-wafer manufacturing platform[J]. Journal of Semiconductors, 2022, 43(10): 102501

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    Paper Information

    Category: Articles

    Received: May. 25, 2022

    Accepted: --

    Published Online: Nov. 18, 2022

    The Author Email: Liu Hongxi (hongxi_liu@tmc-bj.cn), Wang Gefei (gefei_wang@tmc-bj.cn), Cao Kaihua (kaihua.cao@buaa.edu.cn)

    DOI:10.1088/1674-4926/43/10/102501

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