Laser & Optoelectronics Progress, Volume. 59, Issue 5, 0506006(2022)
Strain Transfer and Its Influencing Factors of Matrix Encapsulated Fiber Bragg Grating Sensor
Fig. 1. Physical picture of the FBG sensor
Fig. 2. Three-dimensional model of the FBG sensor
Fig. 3. Section size of the FBG sensor
Fig. 4. Schematic diagram of the ends-bonding of FBG sensor
Fig. 5. Schematic diagram of sensor micro element section
Fig. 6. Force distribution of the FBG section
Fig. 7. Force distribution of the bonding layer
Fig. 8. Meshing of the senser. (a) Global mesh; (b) locally enlarged mesh
Fig. 9. Schematic diagram of constraints and loads applied by the sensor
Fig. 10. Deformation distribution of the matrix layer
Fig. 11. Deformation distribution of the matrix layer at the joint with the bonding layer
Fig. 12. Relationship between the average strain at the bonding point of the matrix and the average strain of the matrix layer
Fig. 13. Influence of elastic modulus of bonding layer on average strain transfer rate of sensor
Fig. 14. Influence of Poisson's ratio of bonding layer on average strain transfer rate of sensor
Fig. 15. Influence of the distance from FBG to the bottom of bonding layer on average strain transfer rate of sensor
Fig. 16. Influence of bonding layer length on average strain transfer rate of sensor
Fig. 17. Deformation distribution of the sensor. (a) Deformation distribution of the FBG; (b) deformation distribution of matrix layer
Fig. 18. Comparison between theoretical solution and simulation solution. (a) Elastic modulus of the bonding layer; (b) Poisson's ratio of the bonding layer; (c) distance from the FBG to the bottom of the bonding layer; (d) length of the bonding layer
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Dingyi Dan, Keqin Ding, Anqing Shu. Strain Transfer and Its Influencing Factors of Matrix Encapsulated Fiber Bragg Grating Sensor[J]. Laser & Optoelectronics Progress, 2022, 59(5): 0506006
Category: Fiber Optics and Optical Communications
Received: May. 6, 2021
Accepted: Jun. 2, 2021
Published Online: Feb. 22, 2022
The Author Email: Ding Keqin (m17611606831@163.com)