Electro-Optic Technology Application, Volume. 37, Issue 1, 44(2022)

Design of 100 G SR4 Optical Module Based on COB Packaging Technology

YU Pei... WANG Bo and QIN Bin |Show fewer author(s)
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    References(3)

    [3] [3] MARUO H, SEKI Y, UNAMI Y. Development of ultrasonic flip chip bonding for flexible printed circuit[C]//HDP 2004 Shanghai, 2004: 307-310.

    [5] [5] ZEEB E, MLLER B, REINER G, et al. Planar proton implanted VCSEL′s and fiber-coupled 2-D VCSEL arrays[J]. Selected Topics in Quantum Electronics, IEEE Journal of, 1995, 1(2): 616-623.

    [7] [7] HEINRICH J, ZEEB E, EBELING K J. Butt-coupling efficiency of VCSELs into multi-mode fibers[J]. Photonics Technology Letters, IEEE, 1997, 9(12): 1555-1557.

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    YU Pei, WANG Bo, QIN Bin. Design of 100 G SR4 Optical Module Based on COB Packaging Technology[J]. Electro-Optic Technology Application, 2022, 37(1): 44

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    Paper Information

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    Received: Nov. 3, 2021

    Accepted: --

    Published Online: Apr. 22, 2022

    The Author Email:

    DOI:

    CSTR:32186.14.

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