Opto-Electronic Engineering, Volume. 50, Issue 4, 220186(2023)

Research progress of double-sided laser shock peening technology

Yongheng Liu1... Xin Gu1, Daxiang Deng1,* and Yongkang Zhang2 |Show fewer author(s)
Author Affiliations
  • 1School of Mechanical Engineering and Automation, Harbin Institute of Technology, Shenzhen, Shenzhen, Guangdong 518055, China
  • 2School of Mechanical Engineering, Guangdong University of Technology, Guangzhou, Guangdong 510320, China
  • show less
    Figures & Tables(23)
    Schematic diagram of traditional laser shock peening
    Schematic diagram of DSLS
    Schematic diagram of DNLSP
    The variation of residual stress on workpiece surface with impact mode (one side: SLSP; zero phase: DSLSP)[26]
    The topography of the workpiece and the absorption film[29]. (a) The surface morphology of the workpiece; (b) 3D morphology of the workpiece; (c) Surface morphology of the absorption layer; (d) 3D morphology of the absorption layer
    Double-sided laser shock peening stress wave propagating in the blade[30]. (a) DSLSP; (b) DNLSP
    Residual stress induced by DSLSP[11]. (a) Surface residual stress; (b) Residual stress in the thickness direction
    Residual stress field of DLSP. (a) Effect of sheet thickness on the residual stress field of DSLSP[27]; (b) Residual stress field of DNLSP[34]
    Stress distribution at the edge induced by double-sided laser shock peening[30]. (a) DNLSP; (b) DSLSP
    Titanium alloy sheet subject to DNLSP[22]. (a) Transverse plastic strain distribution in the thickness direction; (b) Equivalent bending moment of SLSP and DLSP under different energy; (c) Parts after laser shock peening; (d) Contour graph
    Crack propagation path[38]. (a) Before grain refinement; (b) After grain refinement
    Unfavorable stress distribution induced by DSLSP[41]
    Two different scan paths[43]. (a) Z-scan path; (b) Optimized scanning path
    Different laser shock processing strategies[46]. (a) Path 1; (b) Path 2; (c) Path 3
    Different laser shock processing strategy[35]. (a) Strategy 1; (b) Strategy 2; (c) Strategy 3
    Influence of region design of DSLSP on the strengthening effect[47]. (a) Impact zone design; (b) Life extension effect; (c) Edge collapse
    Different DSLSP loading modes in two impact regions[48]. (a) Geometric dimensions of the workpiece; (b) Impact area 1; (c) Impact area 2
    Soft and hard alternate energy absorption structures and grain distribution refined by laser shock peening. (a) Soft and hard alternating energy absorbing structures; (b) Grain distribution refinement[48]
    Schematic illustrations of laser shock wave interaction on Mg-Al-Mn alloy sheet subjected to DSLSP[49]. (a) One-sided LSP impacts; (b) Two-sided and simultaneous LSP impacts for the thin sheet; (c) Two-sided and simultaneous LSP impacts for the thin sheet
    Variation of residual stress along the thickness direction[52]
    • Table 1. Comparison and summary of DSLSP

      View table
      View in Article

      Table 1. Comparison and summary of DSLSP

      DNLSPDSLSP
      技术原理双光束上下入射双光束同步入射
      优点控性强化控形强化
      缺点冲击低刚度件产生大变形或断裂中性层附近可能存在高幅值残余拉应力或层裂
      物理机制诱导近似对称分布的塑性应变诱导完全对称分布的塑性应变
      应用领域一定刚度的薄壁件低刚度的薄壁件
    • Table 2. Effects of impact mode and thickness on stress wave propagation and stress field distribution

      View table
      View in Article

      Table 2. Effects of impact mode and thickness on stress wave propagation and stress field distribution

      双面同步冲击双面异步冲击
      CRS: compressive residual stress; TRS: tensile residual stresses; 0: no residual stress
      薄壁件(应力波相互作用强)(应力波无相互作用)
      CRS-TRS-CRS-TRS-CRS对称分布CRS-TRS-CRS非对称分布
      厚壁件(应力波相互作用弱)(应力波无相互作用)
      CRS-TRS-0-TRS-CRS对称分布CRS-TRS-0-TRS-CRS对称分布
    • Table 3. Maximum deformation of the model in single-sided, double-sided simultaneous (DSLSP) and double-sided non-simultaneous(DNLSP) shock under different scan paths

      View table
      View in Article

      Table 3. Maximum deformation of the model in single-sided, double-sided simultaneous (DSLSP) and double-sided non-simultaneous(DNLSP) shock under different scan paths

      扫描路径1/mm扫描路径2/mm扫描路径3/mm
      单面−1.091−1.070−1.098
      双面同步−0.00409−0.00415−0.00427
      双面异步−0.1164−0.1327−0.1122
    Tools

    Get Citation

    Copy Citation Text

    Yongheng Liu, Xin Gu, Daxiang Deng, Yongkang Zhang. Research progress of double-sided laser shock peening technology[J]. Opto-Electronic Engineering, 2023, 50(4): 220186

    Download Citation

    EndNote(RIS)BibTexPlain Text
    Save article for my favorites
    Paper Information

    Category: Article

    Received: Jul. 29, 2022

    Accepted: Dec. 19, 2022

    Published Online: Jun. 15, 2023

    The Author Email: Deng Daxiang (dengdaxiang@hit.edu.cn)

    DOI:10.12086/oee.2023.220186

    Topics