Microelectronics, Volume. 54, Issue 2, 264(2024)

Corrosion Inhibition Mechanism and Research Progress of Compounding Corrosion Inhibitors in Cu/Co Barrier Layers

LUO Bowen1... GAO Baohong1,2,3, SHI Yuexing4, LI Wenhaoyu1,2,3, HUO Jinxiang1,2,3, and HE Bin1,23 |Show fewer author(s)
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  • 1[in Chinese]
  • 2[in Chinese]
  • 3[in Chinese]
  • 4[in Chinese]
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    Slurry is a crucial component of chemical mechanical polishing (CMP), with corrosion inhibitors being a fundamental part. Traditional corrosion inhibitors exhibit poor corrosion inhibition and low efficiency. However,compounded corrosion inhibitors have emerged as a focal point in CMP research owing to their high efficiency,superior corrosion inhibition effects, and environmental friendliness. In this study, the mechanism of azole corrosion inhibitors on Cu/Co barrier layers is analyzed, and a summary of the recent five-year research progress on new composite inhibitors in the CMP process globally is presented. Evaluations were conducted using various methods such as electrochemical techniques (EIS, OCP, and Tafel), surface analysis techniques (SEM and AFM), and molecular dynamics simulations (DFT and ReaxFF) to analyze the corrosion inhibition effect of these inhibitors.Finally, the current challenges and prospects of composite corrosion inhibitors are summarized

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    LUO Bowen, GAO Baohong, SHI Yuexing, LI Wenhaoyu, HUO Jinxiang, HE Bin. Corrosion Inhibition Mechanism and Research Progress of Compounding Corrosion Inhibitors in Cu/Co Barrier Layers[J]. Microelectronics, 2024, 54(2): 264

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    Paper Information

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    Received: Oct. 3, 2023

    Accepted: --

    Published Online: Aug. 21, 2024

    The Author Email:

    DOI:10.13911/j.cnki.1004-3365.230374

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