Optics and Precision Engineering, Volume. 15, Issue 2, 199(2007)

Finite element simulation on packaging of hinged high-g micromachined accelerometer

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    References(4)

    [3] [3] TANNER D M,WALRAVEN J A,HELGESEN K,et al..MEMS reliability in shock environments[C].IEEE International Reliability Physics Symposium,2000,Piscataway:129-138.

    [4] [4] DAVIES B R,BARRON C C,MONTAGUE S,et al..High g MEMS integrated accelerometer[J].SPIE,1997,3046:52-62.

    [6] [6] HUANG W D,CAI X,XU B L,et al..Packaging effects on the performance of MEMS for high-g accelerometer with double-cantilevers[J].Sensor Actuator A,2003,102 (3):268-278.

    [8] [8] WALTER P L.Trends in accelerometer design for military and aerospace application[J].Sensors Magazine,1999,16(3):21-25.

    CLP Journals

    [1] SHI Qin, SU Yan, QIU An-ping, ZHU Xin-hua. Device level vacuum packaging technologies of MEMS gyroscopes[J]. Optics and Precision Engineering, 2009, 17(8): 1987

    [2] SHAO Jun, YE Jing-feng, HU Zhi-yun, ZHANG Zhen-rong, HUANG Mei-sheng. Numerical calculation of misaligned optical system under interference vibration[J]. Optics and Precision Engineering, 2011, 19(3): 529

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    [in Chinese], [in Chinese], [in Chinese]. Finite element simulation on packaging of hinged high-g micromachined accelerometer[J]. Optics and Precision Engineering, 2007, 15(2): 199

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    Paper Information

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    Received: Oct. 27, 2006

    Accepted: --

    Published Online: Feb. 18, 2008

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