Acta Photonica Sinica, Volume. 52, Issue 12, 1214001(2023)
Ablation Characteristics and Material Removal Mechanism of CVD Single Crystal Diamond Under Femtosecond Laser Irradiation
Diamond has a wide range of applications in the field of precision and ultra-precision machining of hard materials, high frequency and high voltage electronic devices, chip thermal management, and precision optics due to its extremely high hardness, excellent thermal conductivity, extremely high electron mobility, and wide-band optical transparency. Furthermore, it has been demonstrated that the preparation of microstructures on diamonds can significantly enhance the performance of diamond-based devices. However, it is difficult to efficiently prepare microstructures on diamond surfaces using conventional mechanical or chemical methods. Laser processing has become an advanced method to fabricate diamond microstructures due to its low cost, simple process, non-contact machining, high flexibility and high efficiency. Currently, most studies are focused on the optimization of processing parameters and the preparation of diamond microstructures. However, little attention has been paid to the effect of laser parameters on the micro/nano-structures in the laser-ablated area, and the material removal mechanism of the femtosecond laser processing diamond is not clear. Here, in this work, the effects of laser processing parameters such as laser fluence, scanning speed, and number of scans on the microscopic morphology of diamond microgrooves were investigated. The ablation threshold, ablation rate, and material removal rate of diamond processed by femtosecond laser were further obtained. Then the phase transformation of the diamond under femtosecond laser irradiation was analyzed through Raman detection. The effect of laser fluence on the Raman spectra which was detected at the central region of the diamond microgroove was further investigated. The residual stresses in the center of the diamond microgrooves under different laser fluences were calculated based on the wave number shift of the diamond peak. Finally, the temperature field of femtosecond laser-irradiated diamond was simulated using ANSYS finite element software, and the removal mechanism of diamond material was analyzed. It was found that femtosecond laser ablation of diamond microgrooves resulted in a clean surface and debris-free edges, but micro-cracks along the
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Hui WANG, Qiuling WEN, Hui HUANG, Guoqin HUANG, Feng JIANG, Jing LU, Xian WU. Ablation Characteristics and Material Removal Mechanism of CVD Single Crystal Diamond Under Femtosecond Laser Irradiation[J]. Acta Photonica Sinica, 2023, 52(12): 1214001
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Received: May. 22, 2023
Accepted: Aug. 4, 2023
Published Online: Feb. 19, 2024
The Author Email: WEN Qiuling (qlwen@hqu.edu.cn)