Infrared and Laser Engineering, Volume. 48, Issue 7, 742001(2019)
ESCV cutting method during infrared crystal single point diamond turning process
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Wang Peng, Xue Dongbai, Zhang Hao, Yang Kun, Li Weihao, Hui Changshun. ESCV cutting method during infrared crystal single point diamond turning process[J]. Infrared and Laser Engineering, 2019, 48(7): 742001
Paper Information
Received: Feb. 5, 2019
Accepted: Mar. 3, 2019
Published Online: Aug. 7, 2019
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