Infrared and Laser Engineering, Volume. 51, Issue 1, 20210897(2022)
Development and application of short wavelength infrared detectors (Invited)
Fig. 2. Traditional flip chip bonding technology via indium (a) and SONY's copper-copper connection technology (b)
Fig. 5. (a) Sea rainfall imaging; (b) Drug bottle label imaging; (c) Chip alignment marking; (d) Semiconductor crack detection
Fig. 7. Thermal imaging and responsivity of short and medium wavelength at 77 K
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Xu Ma, Yunxue Li, Runyu Huang, Haifeng Ye, Zepeng Hou, Yanli Shi. Development and application of short wavelength infrared detectors (Invited)[J]. Infrared and Laser Engineering, 2022, 51(1): 20210897
Category: Infrared technology and application
Received: Nov. 25, 2021
Accepted: --
Published Online: Mar. 8, 2022
The Author Email: Shi Yanli (ylshikm@hotmail.com)