Optics and Precision Engineering, Volume. 31, Issue 10, 1464(2023)

Study on interfacial bonding strength during fabrication of micro inertial switch

Liqun DU1...2, Dejian KONG2,*, Shuai WANG2, Xiaoke CAI2 and Bingjiang GUO2 |Show fewer author(s)
Author Affiliations
  • 1State Key Laboratory of High-performance Precision Manufacturing, Dalian University of Technology, Dalian6024, China
  • 2Key Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of Technology, Dalian11604, China
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    Figures & Tables(22)
    Component diagram of microinertial switch
    Microelectroforming layer warped off
    Passivated film-Ni bonded layer system
    Stainless steel -Ni bonded layer system
    Passivation film removal rate of 50% doping structure-Ni binding layer system
    Binding energy of the system varies with temperature under different passivation film removal rates
    Model of bonding layer system between transition metal and stainless steel substrate
    Binding energy of the four systems varies with temperature
    Binding energy of Cu, Cr, Ti and Ni castings varies with temperature
    Surface morphology of substrate at different time of electrolysis activation
    Experimental structure of copper transition layer experiment
    Morphology of microelectroforming layer falls off is not fallingafter ultrasonic vibration
    Surface morphology of the substrate before and after Cu layer was prepared
    Fabrication process of micro inertial switch
    Experimental apparatus for electrolytic activation
    Cu transition layer uniformly covering the surface of microstructure
    Completed micro inertial switch
    Microswitch production process of the overall picture of the experimental piece
    • Table 1. Relationship between the mean value of binding energy of different systems

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      Table 1. Relationship between the mean value of binding energy of different systems

      Material

      name

      Binding energy of stainless steel

      (kJ·mol-1

      Interface bonding strength of stainless steel(Ni-stainless steel as 1)Binding energy of Ni(kJ·mol-1

      Interfacial bonding strength of Ni

      (Ni-stainless steel as 1)

      Cu4.674×1041.8112.936×1045.01
      Ti3.925×1041.525.446×1042.11
      Ni2.583×1041\\
      Cr1.794×1040.697.313×1042.83
      Stainless steel\\2.583×1041
    • Table 2. Experimental parameters of electrolytic activation

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      Table 2. Experimental parameters of electrolytic activation

      ProjectNumerical value/Condition
      Voltage/V15
      ElectrolyteWt 15%NaCl
      Electrolyte temperature /℃25
      Time/s0,20,40,60
      Duty cycle/%15
      Frequency/kHz25
      Substrate materialSUS 316
    • Table 3. Measurement results of interface bonding strength in electrolysis activation experiment

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      Table 3. Measurement results of interface bonding strength in electrolysis activation experiment

      Test sampleUltrasonic vibration timePassivation film removal rateExperimental result
      Inactivation3 min 30 s0%Electroforming layer falls off
      Activation 20 s15 min20%Electroforming layer is intact
      Activation 40 s15 min60%Electroforming layer is intact
      Activation 60 s15 min85%Electroforming layer is intact
    • Table 4. Measurement results of interface bonding strength of copper transition layer

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      Table 4. Measurement results of interface bonding strength of copper transition layer

      Test sampleStart shedding timeComplete shedding timeExperimental result
      No Cu layer1 min 45 s3 min 27 sNi layer falls off
      Cu layer4 min 15 s6 min 22 sNi layer falls off
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    Liqun DU, Dejian KONG, Shuai WANG, Xiaoke CAI, Bingjiang GUO. Study on interfacial bonding strength during fabrication of micro inertial switch[J]. Optics and Precision Engineering, 2023, 31(10): 1464

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    Paper Information

    Category: Micro/Nano Technology and Fine Mechanics

    Received: Nov. 29, 2022

    Accepted: --

    Published Online: Jul. 4, 2023

    The Author Email: KONG Dejian (k1142027444@163.com)

    DOI:10.37188/OPE.20233110.1464

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