Optics and Precision Engineering, Volume. 31, Issue 10, 1464(2023)
Study on interfacial bonding strength during fabrication of micro inertial switch
Fig. 5. Passivation film removal rate of 50% doping structure-Ni binding layer system
Fig. 6. Binding energy of the system varies with temperature under different passivation film removal rates
Fig. 7. Model of bonding layer system between transition metal and stainless steel substrate
Fig. 8. Binding energy of the four systems varies with temperature
Fig. 9. Binding energy of Cu, Cr, Ti and Ni castings varies with temperature
Fig. 10. Surface morphology of substrate at different time of electrolysis activation
Fig. 11. Experimental structure of copper transition layer experiment
Fig. 11. Morphology of microelectroforming layer falls off is not fallingafter ultrasonic vibration
Fig. 12. Surface morphology of the substrate before and after Cu layer was prepared
Fig. 15. Cu transition layer uniformly covering the surface of microstructure
Fig. 17. Microswitch production process of the overall picture of the experimental piece
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Liqun DU, Dejian KONG, Shuai WANG, Xiaoke CAI, Bingjiang GUO. Study on interfacial bonding strength during fabrication of micro inertial switch[J]. Optics and Precision Engineering, 2023, 31(10): 1464
Category: Micro/Nano Technology and Fine Mechanics
Received: Nov. 29, 2022
Accepted: --
Published Online: Jul. 4, 2023
The Author Email: KONG Dejian (k1142027444@163.com)