Electronics Optics & Control, Volume. 21, Issue 9, 99(2014)

A Digital Prototype Based Reliability Design and Analysis Method for Electronic Products

LIU Liu1... ZHOU Lin1 and SHAO Jiang2 |Show fewer author(s)
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  • 1[in Chinese]
  • 2[in Chinese]
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    References(8)

    [1] [1] SNOOK IMARSHALL J MNEWMAN R M.Physics of failure as an integrated part of design for reliability [J].The Journal of the Safety and Reliability Society200327(1):29-48.

    [2] [2] PECHT MDASGUPTA ABARKER Det al.The reliability physics approach to failure prediction modeling [J].Quality and Reliability Engineering International20076(4):267-273.

    [3] [3] LI Y HWANG HXU M.Virtual qualification of the aircraft computer based on physicsoffailure reliability assessment approach [C]//Proceedings of the 4th International Conference on Quality and Reliability2005:765-772.

    [4] [4] OSTERMAN MSTADTERMAN T.Failure assessment software for circuit card assemblies [C]//Proceeding of Annual Reliability and Maintainability SymposiumWashington D.C1999:269-276.

    [5] [5] PECHT MGU J.Physicsoffailure based prognostics for electronic products[J].Transactions of the Institute of Measurement and Control200931(3/4):309-322.

    [6] [6] ZHANG RWANG K WSHEN Z R.Research on reliability simulation test technology application of high reliability electronic equipment[J].Electronic Product Reliability and Environmental Testing201230(16):13-19.

    [7] [7] ENGELMAIER W.Fatigue life of leadless chip carriers solder joints during power cycling[J].IEEE Transactions on ComponentsHybridsand Manufacturing Technology19836(3):232-237.

    [8] [8] STEINBERG D S.Cooling techniques for electronic equipment[M].2nd ed.New York:John Wiley & SonsInc.1991.

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    LIU Liu, ZHOU Lin, SHAO Jiang. A Digital Prototype Based Reliability Design and Analysis Method for Electronic Products[J]. Electronics Optics & Control, 2014, 21(9): 99

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    Paper Information

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    Received: May. 4, 2014

    Accepted: --

    Published Online: Sep. 15, 2014

    The Author Email:

    DOI:10.3969/j.issn.1671-637x.2014.09.022

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