Journals Articles Conferences News About CLP
Submit a paper Email Alert
Search
Search
Articles
Journals
News
Advanced Search
Top Searches
2D MaterialsTransformation opticsQuantum PhotonicsSmall lasersSemiconductor UV PhotonicsSupersymmetric microring laser arrays

Chinese Optics Letters, Volume. 16, Issue 1, 011404(2018)

Stress damage process of silicon wafer under millisecond laser irradiation

Zhichao Jia1, Tingzhong Zhang2, Huazhong Zhu1, Zewen Li1, Zhonghua Shen1, Jian Lu1, and Xiaowu Ni1、*
Author Affiliations
  • 1School of Science, Nanjing University of Science & Technology, Nanjing 210094, China
  • 2Institute of Mechanical and Electrical Engineering, Zhoukou Normal University, Zhoukou 466000, China
    • show less
    Full TextGet PDF
    Figures&Tables (8)
    Equations (4)
    References (18)
    Cited By (13)
    Tools
    Paper Information
    Topics
    Cited By

    Article index updated:Mar. 8, 2024

    Citation counts are provided from Web of Science. The counts may vary by service, and are reliant on the availability of their data.
    The article is cited by 13 article(s) from Web of Science.
    Tools

    Get Citation

    Copy Citation Text

    Zhichao Jia, Tingzhong Zhang, Huazhong Zhu, Zewen Li, Zhonghua Shen, Jian Lu, Xiaowu Ni. Stress damage process of silicon wafer under millisecond laser irradiation[J]. Chinese Optics Letters, 2018, 16(1): 011404

    Download Citation

    EndNote(RIS)BibTexPlain Text
    Set citation alerts for article
    Save article for my favorites
    Paper Information

    Category: Lasers and Laser Optics

    Received: Sep. 12, 2017

    Accepted: Dec. 1, 2017

    Published Online: Jul. 17, 2018

    The Author Email: Xiaowu Ni (nxw@njust.edu.cn)

    DOI:10.3788/COL201816.011404

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology