Infrared and Laser Engineering, Volume. 52, Issue 1, 20220279(2023)

Process development and characteristic evaluation of micro-bolometer device

Wei Liu, Bing He, Te Ma, and Gang Liu
Author Affiliations
  • Rocket Force University of Engineering, Xi'an 710025, China
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    Figures & Tables(10)
    Schematic of micro-bolometer structure view
    Schematic of infrared micro-bolometer structure
    RS distribution map of 1000 Å α-Si thin film
    Relationship of TCR with temperature of 1000Å α-Si thin film
    Particle map of 1000 Å α-Si thin film
    (a) Topview SEM of MEMS micro-bridge structure; (b) Cross-sectional view SEM of anchor and contact structure
    Cross-sectional TEM photo of α-Si sensing resistor on the micro-bridge surface
    I-V curve of electrode layer defined α-Si sensing resistor device
    Relationship of TCR with temperature of α-Si sensing resistor
    Optical photo of MEMS micro-bridge structure based micro-bolometer array device after releasing
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    Wei Liu, Bing He, Te Ma, Gang Liu. Process development and characteristic evaluation of micro-bolometer device[J]. Infrared and Laser Engineering, 2023, 52(1): 20220279

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    Paper Information

    Category: Infrared technology and application

    Received: Apr. 24, 2022

    Accepted: --

    Published Online: Feb. 9, 2023

    The Author Email:

    DOI:10.3788/IRLA20220279

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