Infrared and Laser Engineering, Volume. 53, Issue 6, 20240065(2024)
Research on bonding method of light detector assembly of space remote sensing camera
Figures & Tables(20)
![Relationship between shear strength of epoxy adhesive and thickness of adhesive layer[14]](/Images/icon/loading.gif){kind=icon}
Fig. 3. Relationship between shear strength of epoxy adhesive and thickness of adhesive layer[14]
Fig. 4. Relationship between shear strength of silicone rubber and thickness of adhesive layer[15]
Fig. 5. The schematic diagram of the bonding structure between the detector and the base
Fig. 6. Welding schematic diagram of circuit board and focal plane assembly
Table 1. Adhesive properties
View tableView in ArticleTable 1. Adhesive properties
Properties Merit Fault Application Epoxy resin High bonding strength, low curing shrinkage, weather resistance High brittleness, insufficient toughness, difficult to peel Aerospace, electronics, optics, etc Acrylic resin Fast curing, impact resistant Difficult to peel, poor stability, monomer volatile Automobile fuel tanks, electrical appliances,etc UV glue Controlled curing speed, environmentally friendly Curing requires UV lamp equipment, difficult to peel Medical, electrical appliances, etc Polyurethane Wide range of materials, adjustable flexibility, low temperature resistance Poor heat resistance, not acid- resistance, easy to produce bubbles Automotive, machinery, wood, etc Anaerobic adhesive Low viscosity, fast curing at room temperature, easy to remove Highly demanding bonding surfaces, sensitive to temperature and pressure Mechanical locking, leak-proof sealing, etc Silicone rubber Resistance to oxidation and temperature change Slightly lower bond strength Electronics, electrical appliances, etc
Table 2. Calculation results of adhesive layer thickness
View tableView in ArticleTable 2. Calculation results of adhesive layer thickness
Bonding agent Epoxy glue Silicone rubber Bonding position Long side Short side Long side Short side Thickness/mm 0.39 0.33 0.21 0.18
Table 3. Binding scheme
View tableView in ArticleTable 3. Binding scheme
No. Bottom adhesive and bonding area/mm2 Side adhesive and bonding area/mm2 1 Epoxy glue/907.5 - 2 Epoxy glue/907.5 Silicone rubber/598.3 3 Epoxy glue/907.5 Epoxy glue/598.3 4 Silicone rubber/ 907.5 Epoxy glue/598.3 5 Silicone rubber/ 907.5 Silicone rubber/598.3 6 Silicone rubber/ 907.5 Silicone rubber(dot-coated epoxy on top surface)/598.3
Table 4. Detector photosensitive surface output node displacement
View tableView in ArticleTable 4. Detector photosensitive surface output node displacement
No. Output unit ∆x/10−3 mm ∆y/10−3 mm ∆z/10−3 mm ∆s/10−3 mm $\overline{\Delta {s}} $ 1 ① −0.264 6 1.2705 0.0870 1.301 1.0683 ② 0.268 4 1.1976 0.0693 1.229 ③ 0.008 1 1.3612 0.1261 1.367 ④ 0.132 2 0.7017 −0.1145 0.723 ⑤ −0.087 6 0.71391 −0.0561 0.721 2 ① −0.278 7 1.7554 0.1703 1.785 1.4838 ② 0.281 6 1.6550 0.1481 1.685 ③ −0.016 3 1.9191 0.1201 1.923 ④ 0.098 2 0.9942 −0.0152 0.999 ⑤ −0.089 1 1.0231 −0.0164 1.027 3 ① −0.3038 1.7940 0.1914 1.83 1.4966 ② 0.3023 1.6945 0.1763 1.73 ③ −0.0169 1.8699 0.0991 1.873 ④ −0.1092 1.0318 −0.0116 1.038 ⑤ 0.1175 1.0054 −0.0084 1.012 4 ① −0.4186 1.5435 0.1382 1.605 1.2717 ② 0.4099 1.4483 0.1231 1.51 ③ −0.0205 1.5131 0.0472 1.514 ④ −0.1503 0.8490 −0.1542 0.876 ⑤ 0.1616 0.8255 −0.1460 0.854 5 ① −0.3124 1.4898 0.0429 1.523 1.1877 ② 0.3126 1.4129 0.0221 1.447 ③ 0.0088 1.4641 0.0821 1.466 ④ −0.0861 0.7345 −0.1982 0.766 ⑤ 0.1067 0.7038 −0.1910 0.737 6 ① −0.3047 1.4197 0.3842 1.502 1.1691 ② 0.3188 1.3432 0.3463 1.423 ③ 0.0442 1.4298 0.3119 1.464 ④ −0.0874 0.7210 0.1429 0.740 ⑤ 0.1363 0.6997 0.0722 0.716
Table 5. Temperature change experiment condition
View tableView in ArticleTable 5. Temperature change experiment condition
Parameter Experiment condition Pressure Atmospheric Temperature −22 ℃/+42 ℃ Time 2 h Cycle times 4.5 Tolerance Low-temperature（T0+4）℃， High-temperature（T0−4）℃ Rate of change (temperature) 3-5 ℃/min
Table 6. Marking point test data before and after the test
View tableView in ArticleTable 6. Marking point test data before and after the test
No. Marker Pre-test/mm Post-thermal cycling/mm Post-vibration/mm 1 L (0,0,0) (0,0,0) (0,0,0) R (−0.051,−30.457,−0.02) (−0.053,−30.456,−0.02) (−0.052,−30.455,−0.02) 5 L (0.107,−160.343,−0.11) (0.106,−160.336,−0.11) (0.106,−160.336,0.12) R (0.029,−190.801,−0.13) (0.028,−190.794,−0.13) (0.028,−190.796,−0.13) 6 L (−0.031,−80.411, 0.01) (−0.031,−80.407,0.01) (−0.03,−80.408,0.01) R (−0.007,−110.870,0) (−0.006,−110.865,0) (−0.006,−110.867,0)
Table 7. Detector coplanar accuracy detection data
View tableView in ArticleTable 7. Detector coplanar accuracy detection data
No. Post-thermal cycling Post-vibration Flatness/ mm Parallelism change/mm Flatness/ mm Parallelism change/mm 1 0.0043 0.0036 0.0005 0.0039 5 0 0.0004 0.0003 0.0012 6 0.0007 0.0001 0 0.0001
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Jinhui LI, Yingbo ZHU, Shanshan CONG, Lei ZHANG. Research on bonding method of light detector assembly of space remote sensing camera[J]. Infrared and Laser Engineering, 2024, 53(6): 20240065
Paper Information
Category: Optical design
Received: Feb. 10, 2024
Accepted: --
Published Online: Jul. 31, 2024
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