Infrared and Laser Engineering, Volume. 53, Issue 3, 20230654(2024)
Research on packaging technology for 40 K dual-band long-wave detectors
Fig. 4. Schematic diagram of the flatness adjustment mechanism for dual band detectors
Fig. 5. Schematic diagram of three-dimensional adjustment of detector module
Fig. 8. Low temperature stress under different thermal layer structures
Fig. 9. Low temperature stress under different thermal layer structures
Fig. 10. Low temperature stress under different thermal layer structures
Fig. 11. Low temperature deformation of detector diagonal distance
Fig. 12. Temperature gradient verification principle and thermal network model. (a) Temperature gradient verification principle; (b) The figure of thermal network model
Fig. 15. Filter holder support structure and low temperature deformation test of filter. (a) Filter holder support structure; (b) Low temperature deformation testing device for optical filters
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Xiaokun Wang, Junlin Chen, Shaobo Luo, Zhijiang Zeng, Xue Li. Research on packaging technology for 40 K dual-band long-wave detectors[J]. Infrared and Laser Engineering, 2024, 53(3): 20230654
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Received: Nov. 22, 2023
Accepted: --
Published Online: Jun. 21, 2024
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