Laser & Optoelectronics Progress, Volume. 60, Issue 18, 1811011(2023)

Research Progress of Terahertz Mixer Technology

Jian Zhou*, Lixing You, Wei Peng, and Zhen Wang
Author Affiliations
  • Laboratory of Superconductor Electronics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China
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    Figures & Tables(26)
    Schematic diagram of mixer signal transmission
    Schottky barrier diode structure (left) [1] and planar Schottky diode structure (right) [2]
    Schematic diagram of harmonic mixer (left)[3] and top view of Schottky inverse parallel diode mixer (right)[2]
    Energy band diagram (left) and I-V curve (right) of SIS junction[5]
    Typical scheme of IF/DC signal connection for SIS mixer[5]
    IF dependence of mixed signal intensity at temperature of 94 K[7]
    Schottky diode equivalent model[17]
    Schottky diode structure in terms of parasitic parameters (left) and diode material parameters (right)[18]
    Structure of InP based Schottky diode
    Monolithic integrated HTS THz mixer equivalent circuit (left) and HTS THz mixer frequency response simulation (right)[34]
    Josephson junction simulation equivalent circuit[35]
    Schematic diagram of SIS mixer with integrated antenna, microstrip impedance converter, and superconducting junction (left) and S11 curve for direct coupling of antenna and SIS junction (right)[36]
    Geometry of double junction SIS tuned circuit[37]
    Optical micrograph of NbN/AlN/NbN mixer with integrated tuning circuits (left) and DSB noise temperature as a function of LO frequency (right)[43]
    Balanced mixer on wafer[44]
    Diagram of balanced mixer device. (a) Balanced mixer device within waveguide mixer module; (b) signal path diagram of balanced mixer[44]
    Optical micrograph of 0.5 THz all-NbN SIS mixer chip part(left) and receiver noise temperature and reduction in gap voltage versus bath temperature for SIS mixers (right) [45]
    I-V curve, noise temperature, and IF characteristics of balanced SIS mixer.(a) Pump I-V curves for four SIS junction array when LO is 133 GHz; (b) measured noise temperature and IF as a function of bias voltage when LO is 155 GHz[47]
    Schematic diagram of radiative coupling and temperature readout[50]
    100× optical magnification of HEB device graph (left) and schematic of cross-sectional structure of NbN HEB device (right)[54]
    HEB mixer DSB noise temperature versus frequency[55]. ‘o’, ‘□’, ‘+’ data are from Refs. [57-58]
    TRecDSB frequency data from different research groups[14]
    Schematic diagram of various orientation angles of round bottom edge[59]
    Photograph of mixer and junction area (left) and packaged mixer (chip 5 mm×5 mm) (right)[62]
    • Table 1. Performance comparison of foreign harmonic mixers based on Schottky diode

      View table

      Table 1. Performance comparison of foreign harmonic mixers based on Schottky diode

      RF band /GHzFrequency conversion loss /dBLO power /mWNoise temperature /KHarmonic numberYear

      Author(company)&

      country

      Reference
      1836.855988Second2007Steve Marsh,UK22
      650‒69084.21500Second2010Paul Wilkinson,UK23
      1130‒1220151‒1.56000Second2012Bertrand Thomas,UK24
      1900‒2800301Second2013VDI,USA25
      88‒909‒1615Second2019Kohei Fujiwara,Japan26
      75‒110920Second2021Farran,Ireland27
    • Table 2. Performance comparison of domestic harmonic mixers based on Schottky diode

      View table

      Table 2. Performance comparison of domestic harmonic mixers based on Schottky diode

      RF band /GHzLocal power /dBmFrequency conversion loss /dBDiode typeHarmonic numberYearReference
      90‒100138‒13DMK2308Second201328
      82‒9412.512‒14R23C15Fourth201529
      91‒971911‒18MA4E1310Second201930
      560‒600511.5DBES105aSecond202031
      94109‒14DMK2308Second202132
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    Jian Zhou, Lixing You, Wei Peng, Zhen Wang. Research Progress of Terahertz Mixer Technology[J]. Laser & Optoelectronics Progress, 2023, 60(18): 1811011

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    Paper Information

    Category: Imaging Systems

    Received: Jul. 15, 2022

    Accepted: Aug. 31, 2022

    Published Online: Sep. 19, 2023

    The Author Email: Zhou Jian (zjian@mail.sim.ac.cn)

    DOI:10.3788/LOP222081

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