Study On Optical Communications, Volume. 48, Issue 4, 47(2022)

Research on Thermal Design for QSFP-DD Transceiver Module

Yu YE1、* and Yan-chao MA2
Author Affiliations
  • 1Shenzhen Hi-Optel Technology Co., Ltd., Shenzhen 518000, China
  • 2Shenzhen Hengpu Technology Co., Ltd., Shenzhen 518000, China
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    Figures & Tables(12)
    [in Chinese]
    [in Chinese]
    [in Chinese]
    [in Chinese]
    [in Chinese]
    [in Chinese]
    [in Chinese]
    [in Chinese]
    • Table 1. [in Chinese]

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      Table 1. [in Chinese]

      元器件TOSAROSADSPMCU电源芯片
      热导率/W/(m·K)17.317.3124.0124.0124.0
      发热量/W1.51.07.00.30.3
      体积/cm35.7E-015.3E-012.5E-014.8E-035.9E-03
      发热率/W/cm32.581.872.7660.1950.04
    • Table 2. [in Chinese]

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      Table 2. [in Chinese]

      元器件TOSAROSADSPMCU电源芯片
      温度/℃95.987.6117.384.984.7
    • Table 3. [in Chinese]

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      Table 3. [in Chinese]

       通道0通道1通道2通道3
      TDECQ/dB2.9442.7372.5982.439
      消光比/dB4.1954.0474.3403.958
      接收灵敏度/dBm-9.29-9.87-9.07-9.25
    • Table 4. [in Chinese]

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      Table 4. [in Chinese]

      环境温度/℃模块内部测温/℃功耗/W
      07.555.15
      2532.105.31
      7076.806.30
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    Yu YE, Yan-chao MA. Research on Thermal Design for QSFP-DD Transceiver Module[J]. Study On Optical Communications, 2022, 48(4): 47

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    Paper Information

    Category: Research Articles

    Received: Dec. 28, 2021

    Accepted: --

    Published Online: Aug. 5, 2022

    The Author Email: YE Yu (yu_ye@hioptel.com)

    DOI:10.13756/j.gtxyj.2022.04.010

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