Acta Optica Sinica, Volume. 29, Issue 4, 897(2009)

Assembly and Delay Analysis of Optical Resilient Packet Ring on Packets Encapsulation

Wang Qin1、*, Wu Chongqin1, and Wei Bin2
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    Wang Qin, Wu Chongqin, Wei Bin. Assembly and Delay Analysis of Optical Resilient Packet Ring on Packets Encapsulation[J]. Acta Optica Sinica, 2009, 29(4): 897

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    Paper Information

    Category: Fiber Optics and Optical Communications

    Received: Aug. 26, 2008

    Accepted: --

    Published Online: Apr. 27, 2009

    The Author Email: Qin Wang (02110223@bjtu.edu.cn)

    DOI:

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