Journal of Inorganic Materials, Volume. 37, Issue 5, 579(2022)

Electromagnetic Interference Shielding Properties of SiC Ceramic Matrix Composite Reinforced by Three-dimensional Silicon Carbide Nanowire Network

Jing RUAN1...2,3, Jinshan YANG1,2,*, Jingyi YAN1,2,4, Xiao YOU1,2,4, Mengmeng WANG1,2,4, Jianbao HU1,2, Xiangyu ZHANG1,2, Yusheng DING1,2, and Shaoming DONG1,25,* |Show fewer author(s)
Author Affiliations
  • 11. State Key Laboratory of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, China;
  • 22. Structural Ceramics and Composites Engineering Research Center, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 201899, China
  • 33. School of Physical Science and Technology, ShanghaiTech University, Shanghai 201210, China
  • 44. University of Chinese Academy of Sciences, Beijing 100039, China
  • 55. Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China
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    Figures & Tables(4)
    SEM images of the SiCNWs network preforms prepared by vacuum filtration(a-b) Surface; (c-d) Section
    Influence of the different amount of PyC on the EMI shielding performance of the SiCNWs network(a) SER; (b) SEA; (c) SET; (d) Shielding efficiency
    Pore percentage (a) of different pore sizes, and pore volume of (b) 0-5 μm and (c) 5-1200 μm
    EMI shielding performance of the SiCNWs/SiC ceramic matrix composite after treatment by CVI and PIP process(a) SER; (b) SEA; (c) SET; (d) Shielding efficiency
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    Jing RUAN, Jinshan YANG, Jingyi YAN, Xiao YOU, Mengmeng WANG, Jianbao HU, Xiangyu ZHANG, Yusheng DING, Shaoming DONG. Electromagnetic Interference Shielding Properties of SiC Ceramic Matrix Composite Reinforced by Three-dimensional Silicon Carbide Nanowire Network[J]. Journal of Inorganic Materials, 2022, 37(5): 579

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    Paper Information

    Category: RESEARCH LETTER

    Received: Apr. 1, 2021

    Accepted: --

    Published Online: Jan. 10, 2023

    The Author Email: YANG Jinshan (jyang@mail.sic.ac.cn), DONG Shaoming (smdong@mail.sic.ac.cn)

    DOI:10.15541/jim20210224

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