[1] Huadong Wang, Taihua Zhang. Research progresses on characterization and detection technology of subsurface damages in optical materials. Laser Optoelectronics Progress, 54, 100003(2017).

[2] Ningchang Wang, Feng Jiang, Hui Huang, et al. Review on brittle material subsurface damage detection technology. Journal of Mechanical Engineering, 53, 170-179(2017).

[3] Mingjun Cheng, Huiyao Wang, Jian Cheng, et al. Progress in detection and suppression techniques for processing-induced sub-surface defects of fused silica optical elements. Journal of Mechanical Engineering, 57, 1-19(2021).

[4] [4] Feit M D, Rubenchik A M. Influence of subsurface cracks on laserinduced surface damage [C]LaserInduced Damage in Optical Materials: 2003. SPIE, 2004, 5273: 264272.

[5] B Bertussi, P Cormont, S Palmier, et al. Initiation of laser-induced damage sites in fused silica optical components. Optics Express, 17, 11469-11479(2009).

[6] Longxia Zhang, Xiaobing Zhu, Fengyu Li, et al. Laser-induced thermal damage influenced by surface defects of materials. Acta Optica Sinica, 36, 0914001(2016).

[7] [7] Zhang Jianpu, Sun Huanyu, Wang Shiling, et al. Threedimensional reconstruction technology of subsurface defects in fused silica optical components[J]. Acta Optica Sinica, 2020, 40(2): 0206001. (in Chinese)

[8] J Shen, S Liu, K Yi, et al. Subsurface damage in optical substrates. Optik, 116, 288-294(2005).

[9] B Ghahramani, Z Y Wang. Precision ultrasonic machining process: A case study of stress analysis of ceramic (Al₂O₃). International Journal of Machine Tools and Manufacture, 41, 1189-1208(2001).

[11] B R Lawn, A G Evans, D B Marshall. Elastic/plastic indentation damage in ceramics: the median/radial crack system. Journal of the American Ceramic Society, 63, 574-581(1980).

[12] D B Marshall, B R Lawn, A G Evans. Elastic/plastic indentation damage in ceramics: the lateral crack system. Journal of the American Ceramic Society, 65, 561-566(1982).

[13] B R Lawn, A G Evans. A model for crack initiation in elastic/plastic indentation fields. Journal of Materials Science, 12, 2195-2199(1977).

[17] Qiao Xu, Jian Wang, Ping Ma, et al. Progress of advanced optical manufacturing technology. High Power Laser and Particle Beams, 25, 3098-3105(2013).

[18] Zhuo Wang, Yulie Wu, Yifan Dai, et al. Detection of subsurface damage and material removal mechanism in optical polishing process. Journal of National University of Defense Technology, 31, 107-111(2009).

[19] Zhuo Wang, Yulie Wu, Yifan Dai, et al. Characterization of subsurface damage of optical materials in lapping process. Nanotehcnology and Precision Engineer, 6, 349-355(2008).

[20] Na Qin, Liang Zheng, Yalong Liu, et al. Subsurface damage detection of RB-SiC and its subsurface damage characteristics in rotating ultrasonic grinding. Optical and Precision Engineering, 25, 2714-2724(2017).

[22] Y X Zhang, R K Kang, D M Guo, et al. Raman microspectroscopy study on the ground surface of monocrystalline silicon wafers. Key Engineering Materials, 304-305, 241-245(2006).

[23] Le Xu, Jian Guo, Bingjun Yu, et al. Rapid detection on the thickness of subsurface damage layer of silicon. Journal of Mechanical Engineering, 52, 108-114(2016).

[24] J Hutchinson, N Fleck. Strain gradient plasticity. Advances in Applied Mechanics, 33, 295-361(1997).

[25] Gailing Li, Yulie Wu, Zhuo Wang, et al. Experiment study on the destructive measurement of the depth of SSD for optical material. Aviation Precision Manufacturing Tehcnology, 42, 19-22(2006).

[26] Yanpeng Wu, Wei Yang, Hui Ye, et al. Study on subsurface damage depth and morphology of optical elements. Manufacturing Technology & Machine Tool, 10, 74-77(2013).

[27] Zihua Dai, Yongwei Zhu, Jianbin Wang, et al. Measurement of subsurface damage of K9 glass by step-by-step etching method. Optics and Precision Engineering, 21, 287-293(2013).

[28] Z Wang, L Wang, J Yang, et al. Detection of subsurface trace impurity in polished fused silica with biological method. Optics Express, 22, 21292-21301(2014).

[29] Chenlin Hu, Guo Bi, Hui Ye, et al. Research on detection of subsurface damage on grinding optical elements. Journal of Synthetic Crystals, 43, 2929-2934(2014).

[30] A Esmaeilzare, A Rahimi, S M Rezaei. Investigation of subsurface damages and surface roughness in grinding process of Zerodur® glass-ceramic. Applied Surface Science, 313, 67-75(2014).

[31] Yinxia Zhang, Lele Yang, Wei Gao, et al. Cross-sectional microscopy detection technology for subsurface damage of fixed abrasive lapped SiC wafers. Journal of Synthetic Crystals, 42, 906-910(2013).

[33] Jian Wang, Feifei Zheng, Zhigang Dong, et al. Detection method of subsurface damage of silicon carbide after grinding. Diamond and Abrasives Engineering, 35, 60-65(2015).

[35] [35] Arrasmith S R, Jacobs S D, Lambropoulos J C, et al. Use of magheological finishing (MRF) to relieve residual stress subsurface damage on lapped semiconduct silicon wafers [C]Optical manufacturing testing IV. SPIE, 2001, 4451: 286294.

[36] F Yang. Effect of subsurface damage on indentation behavior of ground ULE™ glass. Journal of Non-crystalline Solids, 351, 3861-3865(2005).

[37] T Suratwala, L Wong, P Miller, et al. Sub-surface mechanical damage distributions during grinding of fused silica. Journal of Non-crystalline Solids, 352, 5601-5617(2006).

[39] J A Randi, J C Lambropoulos, S D Jacobs. Subsurface damage in some single crystalline optical materials. Applied Optics, 44, 2241-2249(2005).

[41] [41] ASTM International. ASTM F95098, Stard test method f measuring the depth of crystal damage of a mechanically wked silicon slice surface by angle polishing defect etching [EBOL]. (20210302) [20221124]. https:www.astm.gf095098.html.

[42] Donghui Wen, Tao Hong, Kehua Zhang, et al. Dual-lapping process for sapphire crystal. Optical and Precision Engineering, 17, 6(2009).

[44] E Brinksmeier. State-of-the-art of non-destructive measurement of sub-surface material properties and damages. Precision Engineering, 11, 211-224(1989).

[45] [45] Fine K R, Garbe R, Gip T, et al. Nondestructive realtime direct measurement of subsurface damage [C]Modeling, Simulation, Verification of Spacebased Systems II. SPIE, 2005, 5799: 105110.

[46] J Sindel, A Petschelt, F Grellner, et al. Evaluation of subsurface damage in CAD/CAM machined dental ceramics. Journal of Materials Science: Materials in Medicine, 9, 291-295(1998).

[47] Ailing Tian, Huiting Wang, Juanjuan Dang, et al. A novel method for subsurface damage measurement of optical components. Acta Photonica Sinica, 42, 214-218(2013).

[48] J Neauport, P Cormont, P Legros, et al. Imaging subsurface damage of grinded fused silica optics by confocal fluorescence microscopy. Optics Express, 17, 3543-3554(2009).

[49] W Williams, B Mullany, W Parker, et al. Using quantum dots to evaluate subsurface damage depths and formation mechanisms in glass. CIRP Annals, 59, 569-572(2010).

[50] W B Williams, B A Mullany, W C Parker, et al. Using quantum dots to tag subsurface damage in lapped and polished glass samples. Applied Optics, 48, 5155-5163(2009).

[51] Wei Wang, Lei Zhang, Suya Feng, et al. Using fluorescence microscopy method to study subsurface defects in Nd-doped phosphate laser glasses. Chinese Journal of Lasers, 41, 0906001(2014).

[52] B Ma, Z Shen, P He, et al. Detection of subsurface defects of fused silica optics by confocal scattering microscopy. Chinese Optics Letters, 8, 296-299(2010).

[53] Ailing Tian, Hui Wang, Chunhui Wang. Simulation research on the light-scattering properties of the subfurface damage of optical components. Chinese Journal of Lasers, 40, 0908006(2013).

[54] Ailing Tian, Yujun Tian, Chunhui Wang, et al. Scattering characteristics of focused light beam in medium with subsurface damage. High Power Laser and Particles Beams, 26, 115-121(2014).

[55] Z L Wu, L Sheehan, M R Kozlowski. Laser modulated scattering as a nondestructive evaluation tool for defect inspection in optical materials for high power laser applications. Optics Express, 3, 376-383(1998).

[56] [56] Wu Z, Feit M D, Kozlowski M R, et al. Laser modulated scattering as a nondestructive evaluation tool f optical surfaces thin film coatings [C]LaserInduced Damage in Optical Materials: 1998, Proceedings of SPIE, 1999, 3578: 721729.

[57] P A Temple. Total internal reflection microscopy: A surface inspection technique. Applied Optics, 20, 2656-2664(1981).

[58] [58] Sheehan L M, Kozlowski M, Camp D W. Application of total internal reflection microscopy f laser damage studies on fused silica [C]Proceedings of SPIE, 1998, 3244: 282295.

[59] der Bijl R J M Van, O W Fähnle, Brug H van, et al. In-process monitoring of grinding and polishing of optical surfaces. Applied Optics, 39, 3300-3303(2000).

[60] Hui Cui, Shijie Liu, Yuanan Zhao, et al. Study on total internal reflection microscopy for subsuface damage. Acta Optica Sinica, 34, 0612004(2014).

[61] D Rats, Stebut J Von, F Augereau. High frequency scanning acoustic microscopy: a novel non-destructive surface analytical tool for assessment of coating-specific elastic moduli and tomographic study of subsurface defects. Thin Solid Films, 355, 347-352(1999).

[62] B R Lawn, E R Fuller. Equilibrium penny-like cracks in indentation fracture. Journal of Materials Science, 10, 2016-2024(1975).

[63] S Li, Z Wang, Y Wu. Relationship between subsurface damage and surface roughness of ground optical materials. Journal of Central South University of Technology, 14, 546-551(2007).

[64] [64] Lambropoulos J C, Jacobs S D, Ruckman J. Material Removal Mechanisms from Grinding to Polishing [M]Sabia R, Greenhut V A, Pantano C G. Finishing of Advanced Ceramics Glasses. US: Amer Ceramic Society, 1999: 113128.

[65] Yong Xiang, Jie Ren, Manshe Bai, et al. Prediction method and measurement of the depth of subsurface damage of glass-ceramic by lapping process. Chinese Journal of Lasers, 41, 0708006(2014).

[66] D B Marshall. Geometrical effects in elastic/plastic indentation. Journal of the American Ceramic Society, 67, 57-60(1984).

[67] S S Chiang, D B Marshall, A G Evans. The response of solids to elastic/plastic indentation. I. Stresses and residual stresses. Journal of Applied Physics, 53, 298-311(1982).

[68] D B Marshall, B R Lawn. Residual stress effects in sharp contact cracking. Journal of Materials Science, 14, 2001-2012(1979).

[69] Shengyi Li, Zhuo Wang, Yulie Wu, et al. Prediction theory and experiment of subsurface damage based on lapping processing parameters. Journal of Mechanical Engineering, 45, 192-198(2009).

[70] [70] Bulsara V H, Ahn Y, Chrasekar S, et al. Mechanics of polishing [J]. Journal of Applied Mechanics, 1998, 65(2): 410416.

[71] Y P Chang, M Hashimura, D A Dornfeld. An investigation of material removal mechanisms in lapping with grain size transition. J Manuf Sci Eng, 122, 413-419(2000).