Fig. 1. Material removal in different models

Fig. 2. Abrasive unit cell model

Fig. 3. Surface morphology of fixed abrasive pad

Fig. 4. Micro contact morphology between fixed abrasive lapping pad and workpiece

Fig. 5. Penetration depth of abrasive

Fig. 6. Schematic diagram of double-sided lapping movement

Fig. 7. Schematic diagram of wafer discretization

Fig. 8. CTD calculation process

Fig. 9. Variation law of CTD with m and n

Fig. 10. Variation law of CTD with n

Fig. 11. Variation of CTD with m

Fig. 12. Consolidated abrasive lapping devices

Fig. 13. Variation of CTD and TTV with m and n