Semiconductor Optoelectronics, Volume. 43, Issue 3, 547(2022)

Design and Fabrication of Four Spectral TDICCD Image Sensor

XU Daorun*... LIU Yeqi, YUAN Anbo, LIAO Naiman, QU Pengcheng, LUO Chunlin and ZHANG Xiaoqin |Show fewer author(s)
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    References(1)

    [6] [6] Theuwissen A J P. SolidState Imaging with ChargeCoupled Devices[M]. New York: Kluwer Academic Publishers, 2002.

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    XU Daorun, LIU Yeqi, YUAN Anbo, LIAO Naiman, QU Pengcheng, LUO Chunlin, ZHANG Xiaoqin. Design and Fabrication of Four Spectral TDICCD Image Sensor[J]. Semiconductor Optoelectronics, 2022, 43(3): 547

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    Paper Information

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    Received: Feb. 26, 2022

    Accepted: --

    Published Online: Aug. 1, 2022

    The Author Email: XU Daorun (403236274@qq.com)

    DOI:10.16818/j.issn1001-5868.2022022601

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