Semiconductor Optoelectronics, Volume. 43, Issue 3, 547(2022)
Design and Fabrication of Four Spectral TDICCD Image Sensor
[6] [6] Theuwissen A J P. SolidState Imaging with ChargeCoupled Devices[M]. New York: Kluwer Academic Publishers, 2002.
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XU Daorun, LIU Yeqi, YUAN Anbo, LIAO Naiman, QU Pengcheng, LUO Chunlin, ZHANG Xiaoqin. Design and Fabrication of Four Spectral TDICCD Image Sensor[J]. Semiconductor Optoelectronics, 2022, 43(3): 547
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Received: Feb. 26, 2022
Accepted: --
Published Online: Aug. 1, 2022
The Author Email: XU Daorun (403236274@qq.com)