During laser etching of indium tin oxide （ITO） glass， micro-deformation of the glass workpiece， which results from positioning problems， causes breakpoints or deformation of micro-scale etching lines， resulting in short circuits and open circuits in adjacent areas. Therefore， during the laser etching of ITO glass surface lines， microporous ceramics are typically used to pressurize the workpiece with airflow from a micro-hole array to ensure high-precision laser etching. In this study， the micropore airflow pressure distribution under different processing techniques was analyzed， and the influence of the gas flow pressure and the etching gap on the flatness of the etched surface of the ITO glass was explored. The results revealed that after being pressurized by the microporous airflow， the workpiece is subjected to a positive pressure in the area where the gas flows so that the pressure distribution in the processing area is relatively uniform. Such a uniform air pressure on the surface of the workpiece can prove beneficial for the positioning of the etched surface； however， an excessive pressure may lead to micro-deformation of the workpiece. The experimental results indicate that the flatness can be as low as 8 μm under an appropriate pressure， and at a pressure of 0.16-0.2 kPa and an etching gap of 1.8-1.9 mm， the surface pressure of the workpiece becomes 13.2-14.4 Pa. At this time， the surface degree is the best， and the etched lines on the micron scale are clear and do not cause damage. Finally， the laser etching process of an ITO glass pressurized using a micro-hole airflow was conducted， and surface fine lines of 8 μm and 25 μm could be etched. This resolved the issues of short circuits or open circuits in the product， which are typically caused by local breakpoints or deformations resulting from the etching process， which is usually conducted in the presence of air without micropores.