Optics and Precision Engineering, Volume. 15, Issue 7, 1090(2007)

Variable temperature quasi-creep experiment for fabrication of microfluidic chip using Cyclo-olefin Polymer(COP)

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    References(8)

    [1] [1] WANG H Y,FOOTE R S,JACOBSON S C,et al..Low temperature bonding for microfabrication of chemical analysis devices[J].Sensors and Actuators B:Chemical,1997,45(3):199-207.

    [2] [2] BURNS M A,JOHNSON B N,BRAHMASANDRA S N,et al..An integrated nanoliter DNA analysis device[J].Science,1998,5388(282):484-487.

    [4] [4] GEORGE W,WOODDRUFF III.Microfluidic channels in Polymethylmechacrylate by optimizing aluminum adhesion[C].22nd Annual Microelectronic Engineering Confefence,2004:110-113.

    [5] [5] SHEN X J,PAN L W,LIN L.Microplastic embossing process:experimental and theoretical characterizations[J].Sensors and Actuators A:Physical,2002(97/98):428-433.

    [6] [6] GERLACH A,KNEBEL G,GUBER A E,et al..Microfabrication of single-use plastic microfluidic devices for high-throughput screening and DNA analysis[J].Microsystem Technologies,2002,7(5/6):265-268.

    [7] [7] CHEN Z F,GAOY H,LIN J M,et al..Vacuum-assisted thermal bonding of plastic capillary electrophoresis microchip imprinted with stainless steel template[J].Journal of Chromatography A,2004,1038:239-245.

    [9] [9] LEI K F,LI W J,YAM Y.Effects of contact-stress on hot-embossed PMMA microchannel wall profile[J].Microsystem Technologies,2005,11:353-357.

    [10] [10] SCHEER H C,SCHULA H.A contribution To the flow behaviour of thin polymer films during hot embossing lithography[J].Microelectronic Engineering,2001,56:311-332.

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    [3] LIU Chong, LIANG Yong, LI Jing-min, LIU Jun-shan, WANG Xiao-dong. Design of collision protection system of handling robot for microfluidic chip[J]. Optics and Precision Engineering, 2009, 17(1): 138

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    [in Chinese], [in Chinese], [in Chinese], [in Chinese]. Variable temperature quasi-creep experiment for fabrication of microfluidic chip using Cyclo-olefin Polymer(COP)[J]. Optics and Precision Engineering, 2007, 15(7): 1090

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    Received: Feb. 15, 2007

    Accepted: --

    Published Online: Feb. 18, 2008

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