Infrared and Laser Engineering, Volume. 49, Issue 3, 0303003(2020)

3D information acquisition technology of integral imaging

Yan Xing and Qionghua Wang*
Author Affiliations
  • School of Instrumentation and Optoelectronic Engineering, Beihang University, Beijing 100191, China
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    Figures & Tables(12)
    Schematic of integral imaging 3D information acquirement and display processes
    Schematic of light field sampling in the integral imaging 3D information acquirement process
    Schematic of 3D information acquirement based on telecentric relay system
    Schematic and experimental results of two-step pickup method without black zone
    Integral imaging pickup method using a sparse camera array
    Integral imaging 3D real-time acquirement system using a network camera array
    Integral imaging pickup method with randomly distributed cameras
    Integral imaging 3D information acquirement process based on depth camera
    Integral imaging 3D information acquirement scheme based on multiple structured light
    Schematic of multiple orthographic frustum combing algorithm
    Schematic of rendering algorithm using backward ray-tracing
    • Table 1. Parameter comparison between three integral imaging 3D information acquisition technologies

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      Table 1. Parameter comparison between three integral imaging 3D information acquisition technologies

      Complexity of systemPickup speedAmount of dataPickup resolutionFOVEIA qualityCostSize
      Microlens arrayLowHighSmallLowSmallLowLowSmall
      Camera arrayHighLowLargeHighLargeHighHighLarge
      Depth cameraModerately lowModerately lowModerately smallModerately highModerately largeModerately lowModerately lowSmall
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    Yan Xing, Qionghua Wang. 3D information acquisition technology of integral imaging[J]. Infrared and Laser Engineering, 2020, 49(3): 0303003

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    Paper Information

    Received: Dec. 7, 2019

    Accepted: --

    Published Online: Apr. 22, 2020

    The Author Email: Wang Qionghua (qionghua@buaa.edu.cn)

    DOI:10.3788/IRLA202049.0303003

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