[1] [1] XIONG W, HONG-LI Q I, JI-ZONG W U, et al.. Simulation, fabrication and characterization of an all-metal contact-enhanced triaxial inertial microswitch with low axial disturbance ［C］. IEEE Conference on Local Computer Networks, Edmonton, AB, Canada, 2014:194-203.

[2] [2] WANG Y, CHEN W, YANG Z, et al.. An inertial micro-switch with compliant cantilever fixed electrode for prolonging contact time ［C］. Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems(MEMS), Estoril, 2013:600-603.

[3] [3] CAI H G, YANG ZH Q, DING G F.et al.. Development of a MEMS electrical inertia micro-switch based on non-silicon substrate ［J］. Chinese Journal of Mechanical Engineering, 2009, 45(3): 156-161.(in Chinese)

[4] [4] HUANG X L, XIONG Y, CHEN G Y, et al.. Fabrication of micro spiral acceleration switch using UV-LIGA technology ［J］. Opt. Precision Eng., 2010, 18(5):1152-1158.(in Chinese)

[5] [5] WANG Y, YANG Z, XU Q, et al.. Design, simulation and characterization of a MEMS inertia switch with flexible CNTs/Cu composite array layer between electrodes for prolonging contact time ［J］. Journal of Micromechanics and Microengineering, 2015, 25(8): 085012.

[6] [6] CAO Y, XI Z, YU P, et al.. A MEMS inertial switch with a single circular mass for universal sensitivity ［J］. Journal of Micromechanics and Microengineering, 2015, 25(10): 105005.

[7] [7] XI Z, CAO Y, YU P, et al.. The simulation and visual test contact process of a MEMS inertial switch with flexible electrodes ［J］. Microsystem Technologies, 2015: 1-8.

[8] [8] ZHANG Q, YANG Z, XU Q, et al.. Design and fabrication of a laterally-driven inertial micro-switch with multi-directional constraint structures for lowering off-axis sensitivity ［J］. Journal of Micromechanics and Microengineering, 2016, 26(5): 055008.

[9] [9] TANNER D M, WALRAVEN J A, HELGESEN K, et al.. MEMS reliability in shock environments ［C］.Reliability Physics Symposium, San Jose, California, 2000:129-138.

[10] [10] ZHOU ZH J, NIE W R, XI ZH W, et al.. Anti-impact material properties of UV-LIGA multi-layered electroformed nickel ［J］. Opt. Precision Eng., 2015, 23(4):1044-1052.(in Chinese)

[11] [11] SRIKAR V T, SENTURIA S D. The reliability of microelectromechanical systems(MEMS) in shock environments ［J］. Journal of Microelectromechanical Systems, 2002, 11(3):206-214.

[12] [12] SUNDARAM S, TORMEN M, TIMOTIJEVIC B, et al.. Vibration and shock reliability of MEMS: modeling and experimental validation ［J］. Journal of Micromechanics & Microengineering, 2011, 21(4):45022-45034(13).

[13] [13] HARTZELL A, WOODILLA D. Reliability methodology for prediction of micromachined accelerometer stiction ［C］.Reliability Physics Symposium Proceedings, San Diego, 1999:202-205.

[14] [14] YAO W L, YUE R. The controversial coefficient of restitution for impact problems ［J］. Journal of Vibration and Shock, 2015, 34(19): 43-48.(in Chinese)

[15] [15] HUNT K H, CROSSLEY F R E. Coefficient of restitution interpreted as damping in vibroimpact ［J］. Journal of Applied Mechanics, 1975, 42(2):440-445.

[16] [16] FLORES P, MACHADO M, SILVA M T, et al.. On the continuous contact force models for soft materials in multibody dynamics ［J］. Multibody System Dynamics, 2011, 25(3):357-375.

[17] [17] GILARDI G, SHARF I. Literature survey of contact dynamics modelling ［J］. Mechanism & Machine Theory, 2002, 37(10):1213-1239.

[18] [18] LANKARANI H M, NIKRAVESH P E. A contact force model with hysteresis damping for impact analysis of multibody systems ［J］. Journal of Mechanical Design, 1990, 112(3):369-376.

[19] [19] NIE W, CHENG J, XI Z, et al.. Elastic coefficient analysis on planar S-shaped micro spring under high impact load ［J］. Microsystem Technologies, 2015:1-9.

[20] [20] WAGNER U, MULLER-FIEDLER R, BAGDAHN J, et al.. Mechanical reliability of epipoly MEMS structures under shock load ［C］.Transducers, Solid-State Sensors, Actuators and Microsystems, International Conference, Boston, 2003(1):175-178.