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Chinese Optics Letters, Volume. 7, Issue 3, 03217(2009)

Preparation of solder pads by selective laser scanning

Wenqing Shi1,2, Yongqiang Yang1, Yanlu Huang1, Guoqiang Wei1, and Wei Guo1
Author Affiliations
  • 1School of Mechanical &
  • 2Automotive Engineering, South China University of Technology, Guangzhou 5106402 College of Science, Guangdong Ocean University, Zhanjiang 524088
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    Article index updated: Feb. 24, 2023

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    Wenqing Shi, Yongqiang Yang, Yanlu Huang, Guoqiang Wei, Wei Guo. Preparation of solder pads by selective laser scanning[J]. Chinese Optics Letters, 2009, 7(3): 03217

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    Paper Information

    Received: Jun. 30, 2008

    Accepted: --

    Published Online: Mar. 20, 2009

    The Author Email:

    DOI:10.3788/COL20090703.0217

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology