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Chinese Optics Letters, Volume. 19, Issue 4, 041402(2021)

Combined studies of surface evolution and crack healing for the suppression of negative factors during CO2 laser repairing of fused silica

Chao Tan1, Linjie Zhao1, Mingjun Chen1、*, Jian Cheng1、**, Zhaoyang Yin1, Qi Liu1, Hao Yang1, and Wei Liao2
Author Affiliations
  • 1State Key Laboratory of Robotics and System, Harbin Institute of Technology, Harbin 150001, China
  • 2Research Center of Laser Fusion, China Academy of Engineering Physics, Mianyang 621900, China
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    [8] T. Doualle, L. Gallais, S. Monneret, S. Bouillet, A. Bourgeade, C. Ameil, L. Lamaignère, P. Cormont. Development of a laser damage growth mitigation process, based on CO2 laser micro processing, for the Laser MegaJoule fused silica optics. Proc. SPIE, 10014, 2016.

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    [11] A. Nakamura, T. Mizuta, Y. Shimotsuma, M. Sakakura, T. Otobe, M. Shimizu, K. Miura. Picosecond burst pulse machining with temporal energy modulation [Invited]. Chin. Opt. Lett., 18, 123801(2020).

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    Cited By

    [1] Chao Tan, Linjie Zhao, Mingjun Chen, Jian Cheng, Hao Yang, Qi Liu, Zhaoyang Yin, Wenyu Ding. Morphology evolution mechanisms and localized structural modification of repaired sites on fused silica optics processed by CO2 laser rapid ablation mitigation. Optics & Laser Technology, 147, 107648(2022).

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    Chao Tan, Linjie Zhao, Mingjun Chen, Jian Cheng, Zhaoyang Yin, Qi Liu, Hao Yang, Wei Liao. Combined studies of surface evolution and crack healing for the suppression of negative factors during CO2 laser repairing of fused silica[J]. Chinese Optics Letters, 2021, 19(4): 041402

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    Paper Information

    Category: Lasers, Optical Amplifiers, and Laser Optics

    Received: Aug. 20, 2020

    Accepted: Oct. 9, 2020

    Published Online: Jan. 8, 2021

    The Author Email: Mingjun Chen (chenmj@hit.edu.cn), Jian Cheng (cheng.826@hit.edu.cn)

    DOI:10.3788/COL202119.041402

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology