Optics and Precision Engineering, Volume. 15, Issue 9, 1377(2007)

Study on internal stress of thick SU-8 layer in MEMS

[in Chinese]1 and [in Chinese]2
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
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    References(3)

    [3] [3] LORENZE H,DESPONT M,FAHRNI N,et al..High-aspect-ratio,ultra thick,negative-tone near-UV-LIGAphotoresist and its applications for MEMS[J].Sensors and Actuators A,1998,64:33-39.

    [4] [4] CHANG H K,KIM Y K.UV-LIGA process for high aspect ratio structure using stress barrier and C-shape etchhole[J].Sensors and Actuators A,2000,84:342-350.

    [8] [8] KLEIN C A.How accurate are Stoney's equation and recent modifications[J].Journal of Applied Physics,2000,88(9):5487-5489.

    CLP Journals

    [1] DU Li-qun, LI Cheng-bin, LI Yong-hui, YU Tong-min. Application of ultrasonic stress relief technology to microinjection mold fabrication[J]. Optics and Precision Engineering, 2012, 20(6): 1250

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    [in Chinese], [in Chinese]. Study on internal stress of thick SU-8 layer in MEMS[J]. Optics and Precision Engineering, 2007, 15(9): 1377

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    Paper Information

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    Received: Jan. 25, 2007

    Accepted: --

    Published Online: Feb. 18, 2008

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