Journal of Terahertz Science and Electronic Information Technology , Volume. 18, Issue 3, 531(2020)
A novel measurement method of ultra-low residual stress in MEMS package
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LIUMeng, HUANG Qinghua, XU Wei, TANG Bin. A novel measurement method of ultra-low residual stress in MEMS package[J]. Journal of Terahertz Science and Electronic Information Technology , 2020, 18(3): 531
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Received: Jan. 24, 2019
Accepted: --
Published Online: Jul. 16, 2020
The Author Email: Wei XU (xw198877@gmail.com)
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