Semiconductor Optoelectronics, Volume. 44, Issue 3, 404(2023)

The Influence of Hook Position Deviation of Nondestructive Bond Pulling on Bonding Reliability

BAO Jiang*... LIU Bichen, ZHANG Jianing, ZHAO Ruilian and LI Bing |Show fewer author(s)
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    BAO Jiang, LIU Bichen, ZHANG Jianing, ZHAO Ruilian, LI Bing. The Influence of Hook Position Deviation of Nondestructive Bond Pulling on Bonding Reliability[J]. Semiconductor Optoelectronics, 2023, 44(3): 404

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    Paper Information

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    Received: Nov. 22, 2022

    Accepted: --

    Published Online: Nov. 26, 2023

    The Author Email: Jiang BAO (407257081@qq.com)

    DOI:10.16818/j.issn1001-5868.2022112202

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