Semiconductor Optoelectronics, Volume. 44, Issue 3, 404(2023)

The Influence of Hook Position Deviation of Nondestructive Bond Pulling on Bonding Reliability

BAO Jiang*, LIU Bichen, ZHANG Jianing, ZHAO Ruilian, and LI Bing
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    As for the hook position deviation of nondestructive bond pulling test, the influence factors of the force of bonding wire was analyzed, and the influence of the hook position deviation on the state of the bonding wire was discussed. Further, a reliability verification scheme was proposed. Through experimental comparison, the results show that hook position deviation of the nondestructive bond pulling test has limited influence on bonding reliability.

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    BAO Jiang, LIU Bichen, ZHANG Jianing, ZHAO Ruilian, LI Bing. The Influence of Hook Position Deviation of Nondestructive Bond Pulling on Bonding Reliability[J]. Semiconductor Optoelectronics, 2023, 44(3): 404

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    Paper Information

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    Received: Nov. 22, 2022

    Accepted: --

    Published Online: Nov. 26, 2023

    The Author Email: Jiang BAO (407257081@qq.com)

    DOI:10.16818/j.issn1001-5868.2022112202

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