Semiconductor Optoelectronics, Volume. 44, Issue 3, 404(2023)
The Influence of Hook Position Deviation of Nondestructive Bond Pulling on Bonding Reliability
As for the hook position deviation of nondestructive bond pulling test, the influence factors of the force of bonding wire was analyzed, and the influence of the hook position deviation on the state of the bonding wire was discussed. Further, a reliability verification scheme was proposed. Through experimental comparison, the results show that hook position deviation of the nondestructive bond pulling test has limited influence on bonding reliability.
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BAO Jiang, LIU Bichen, ZHANG Jianing, ZHAO Ruilian, LI Bing. The Influence of Hook Position Deviation of Nondestructive Bond Pulling on Bonding Reliability[J]. Semiconductor Optoelectronics, 2023, 44(3): 404
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Received: Nov. 22, 2022
Accepted: --
Published Online: Nov. 26, 2023
The Author Email: Jiang BAO (407257081@qq.com)