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Acta Photonica Sinica, Volume. 46, Issue 9, 914001(2017)

Thermal Stress and Smile of Conduction-cooled High Power Semiconductor Laser Arrays

LU Yao1,2、*, NIE Zhi-qiang1, CHEN Tian-qi1,2, ZHANG pu1, XIONG Ling-ling1, WU Di-hai1,2, LI Xiao-ning3, WANG Zhen-fu1, and LIU Xing-sheng1,3
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  • 1[in Chinese]
  • 2[in Chinese]
  • 3[in Chinese]
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    LU Yao, NIE Zhi-qiang, CHEN Tian-qi, ZHANG pu, XIONG Ling-ling, WU Di-hai, LI Xiao-ning, WANG Zhen-fu, LIU Xing-sheng. Thermal Stress and Smile of Conduction-cooled High Power Semiconductor Laser Arrays[J]. Acta Photonica Sinica, 2017, 46(9): 914001

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    Paper Information

    Received: Mar. 20, 2017

    Accepted: --

    Published Online: Oct. 16, 2017

    The Author Email: Yao LU (luyao@opt.cn)

    DOI:10.3788/gzxb20174609.0914001

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology