Infrared and Laser Engineering, Volume. 51, Issue 4, 20210333(2022)

Process on ethanol assisted laser ablation dicing of silicon wafer

Wentao Tian, Weicheng Liu, Xuhui Sun, Hongyu Zheng, and Zhiwen Wang
Author Affiliations
  • School of Mechanical Engineering, Shandong University of Technology, Zibo 255000, China
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    Wentao Tian, Weicheng Liu, Xuhui Sun, Hongyu Zheng, Zhiwen Wang. Process on ethanol assisted laser ablation dicing of silicon wafer[J]. Infrared and Laser Engineering, 2022, 51(4): 20210333

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    Paper Information

    Category: Lasers & Laser optics

    Received: May. 24, 2021

    Accepted: --

    Published Online: May. 18, 2022

    The Author Email:

    DOI:10.3788/IRLA20210333

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