Spacecraft Recovery & Remote Sensing, Volume. 45, Issue 2, 92(2024)
Optimization Design of the Heat Transfer Path for a TDI-CMOS Focal Plane Assembly
Figures & Tables(14)
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Table 1. Table of thermal physical parameters of the focal plane assembly
View tableView in ArticleTable 1. Table of thermal physical parameters of the focal plane assembly
组件名称 主要材料 热导率/（W∙m−1∙K−1） 比热容/（J∙kg−1∙K−1） 发热功率/W 质量/g 外壳 铝合金 121 921 0 2 100 PCB-A 耐燃材料FR4 法向：0.38；平面：34.44 1 465 3.7 155 PCB-B 耐燃材料FR4 2.3 58 PCB-C1 耐燃材料FR4 21.3 247 PCB-C2 耐燃材料FR4 6 77 CMOS传感器 陶瓷 30 750 2.7 117
Table 2. Physical properties of the phase change material
View tableView in ArticleTable 2. Physical properties of the phase change material
材料名称 相变温度/℃ 相变潜热/（J∙g−1） 热导率/（W∙m−1∙K−1） 密度/（g/cm3） 比热容/（J∙kg−1∙K−1） S-16 16~18 230 0.2 0.72 2000
Table 3. Temperature variation of CMOS under different heat transfer schemes
View tableView in ArticleTable 3. Temperature variation of CMOS under different heat transfer schemes
方案名称 600 s后温度/℃ 温升/℃ 提升效果/℃ 提升百分比/% 自然状态 33.8 18.8 基板热容法 30.5 15.5 3.3 18 针脚热容法 24 9 9.8 52 侧面接触法 26.2 11.2 7.6 40
Table 4. Temperature of each component after optimization
℃ View tableView in ArticleTable 4. Temperature of each component after optimization
℃ 组件名称 优化前温度 优化后温度 提升效果 基板 24.9 15.9 9 前屉 23.1 16.7 6.4 中屉 24.4 17.7 6.7 底板 26.4 18.4 8 后屉 24.3 16.4 7.9 盖板 24.3 15.6 8.7 CMOS传感器 33.8 19.9 8.9 PCB-A 37.1 31.8 5.3 PCB-B 43.3 31.7 11.6 PCB-C1 37.5 24.5 13 PCB-C2 33.9 27.6 6.3
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Jianchao WANG, Tian BAI, Lin KONG, Feng JIANG, Lei ZHANG. Optimization Design of the Heat Transfer Path for a TDI-CMOS Focal Plane Assembly[J]. Spacecraft Recovery & Remote Sensing, 2024, 45(2): 92
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Received: Feb. 24, 2023
Accepted: Sep. 27, 2023
Published Online: May. 29, 2024
The Author Email: KONG Lin (konglin@charmingglobe.com)
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