Optics and Precision Engineering, Volume. 32, Issue 3, 392(2024)
Process development of small size copper-plated InP wafer with 8-inch CMP equipment
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Ming CHENG, Dongxu ZHAO, Yunpeng WANG, Fei WANG, Yi FAN, Yang JIANG. Process development of small size copper-plated InP wafer with 8-inch CMP equipment[J]. Optics and Precision Engineering, 2024, 32(3): 392
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Received: Jul. 26, 2023
Accepted: --
Published Online: Apr. 2, 2024
The Author Email: ZHAO Dongxu (zhaodx@ciomp.ac.cn)