Acta Photonica Sinica, Volume. 34, Issue 3, 340(2005)
Microcutting Si Wafer in Water Bath by the Second and Third Harmonic Output of YAG Laser
[1] [1] Zhang J,Sugioka K,Midorikawa K. High-speed machining of glass materials by laser-induced plasma-assisted ablation using a 532 nm laser.App Phy A,1998,67(4):499~501
[2] [2] MC Gower. Industrial applications of pulsed lasers to materials processing. SPIE,1998,3343:171~173
[3] [3] Peyre P, Fabbro R, Berthe L,et al. Laser shock processing of materials, physical processes involved and examples of applications. Journal of Laser Applications,1996,8(3):135~141
Get Citation
Copy Citation Text
[in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese]. Microcutting Si Wafer in Water Bath by the Second and Third Harmonic Output of YAG Laser[J]. Acta Photonica Sinica, 2005, 34(3): 340