[4] [4] FRUHAUF J,GARTNER E,JANSCH E,et al..Silicon as a plastic material[J].Micromesh Microeng,1999,9:305-312.

[5] [5] LOSCHNER U,EXNER H,GARTNER,et al..Laser bending of silicon[J].SPIE,2003,4977:86-93.

[6] [6] GARTNER E,FRUHAUF J,LOSCHNER U,et al..Laser bending of etched silicon microstructure[J].Micro sys tem Technologies,2001,7:23-26.

[7] [7] EXNER H,LOSCHNER U.Contactless laser bending of silicon microstructures[J].SPIE,2003,5116:383-392.

[8] [8] ZHANG R X,XU X F.Microscale bending of brittle materials using pulsed and CW lasers[J].SPIE,2002,4637:291-296.

[9] [9] ZHANG R X,XU X F.High precision micro scale bending by pulsed and CW lasers[J].Transactions of the ASME,2003,125(8):512-518.

[10] [10] ZHANG R X,XU X F.Finite element analysis of pulsed laser bending:the effect of melting and solidification[J].Journal of Applied Mechanics,2004,71 (5):321-326.

[11] [11] ZHANG R X,XU X F.Laser bending for high-precision curvature adjustment of micro cantilevers[J].AppliedPhysics Letters,2005,86(021114):1-3.

[12] [12] MICHAEL P,JORG K,HENDRIK W,et al..Processing of silicon by Nd:YAG-lasers with harmonics generation[J].SPIE,2002,4637:496-504.