INFRARED, Volume. 46, Issue 2, 20(2025)
Thermal Damage and Its Control in Helical Laser Processing of Infrared Module Electrode Plates for Packaging
References(4)
[1] [1] Rahim K, Mian A. A Review on Laser Processing in Electronic and MEMS Packaging [J]. Journal of Electronic Packaging, 2017, 139(3): 030801.
[2] [2] Schulz W, Eppelt U, Poprawe R. Review on laser drilling I. Fundamentals, modeling, and simulation [J]. Journal of Laser Applications, 2013, 25(1): 012006.
[4] [4] Hurley M J, Gottuk D, Hall J R, et al. SFPE Handbook of Fire Protection Engineering [M]. Berlin: Springer Nature, 2016.
[5] [5] Bergman T L, Lavine A S, Incropera F P, et al. Fundamentals of Heat and Mass Transfer [M]. Hoboken: John Wiley & Sons, 2018.
Tools
Get Citation
Copy Citation Text
ZHANG Yi-nan. Thermal Damage and Its Control in Helical Laser Processing of Infrared Module Electrode Plates for Packaging[J]. INFRARED, 2025, 46(2): 20
Paper Information
Received: Sep. 25, 2024
Accepted: Mar. 13, 2025
Published Online: Mar. 13, 2025
The Author Email: Yi-nan ZHANG (666shelley@sina.com)
© Copyright 2018-2021 | Chinese Laser Press.
All Rights Reserved 沪ICP备15018463号-20