Microelectronics, Volume. 53, Issue 5, 930(2023)
Study on Thermal Stress of Eutectic Die Attach on K1-5 Shell
Figures & Tables(0)
Tools
Get Citation
Copy Citation Text
LI Jinlong, JIANG Kai, ZHU Hongjiao, QIU Sheng. Study on Thermal Stress of Eutectic Die Attach on K1-5 Shell[J]. Microelectronics, 2023, 53(5): 930
Paper Information
Category:
Received: Feb. 26, 2023
Accepted: --
Published Online: Jan. 3, 2024
The Author Email:
© Copyright 2018-2021 | Chinese Laser Press.
All Rights Reserved 沪ICP备15018463号-20