[1] Liang S J, Tang W L, Jiao X et al. Effect of modified polishing agent on polishing quality of optical glass[J]. Chinese Journal of Lasers, 44, 1203001(2017).

[2] Xia J J, Yu J, Wang Z S et al. Scratch evolution for monocrystalline silicon during chemical-mechanical polishing[J]. Acta Optica Sinica, 42, 0912002(2022).

[3] Preston F W. The theory and design of plate glass polishing machine[J]. Journal of the Society of Glass Technology, 11, 214-256(1927).

[4] Zhang C H, Geng X, Li Z W et al. An overview of research on contact state in chemical mechanical polishing[J]. Surface Technology, 49, 50-56(2020).

[5] Yuh M, Jang S, Kim H et al. Development of green CMP by slurry reduction through controlling platen coolant temperature[J]. International Journal of Precision Engineering and Manufacturing-Green Technology, 2, 339-344(2015).

[6] Shi F G, Zhao B. Modeling of chemical-mechanical polishing with soft pads[J]. Applied Physics A, 67, 249-252(1998).

[7] Shin C, Qin H Y, Hong S et al. Effect of conditioner load on the polishing pad surface during chemical mechanical planarization process[J]. Journal of Mechanical Science and Technology, 30, 5659-5665(2016).

[8] Li J, Huang J D, Xia L et al. Effect of chemical additive on fixed abrasive pad self-conditioning in CMP[J]. The International Journal of Advanced Manufacturing Technology, 88, 107-113(2017).

[9] Lee H, Park B, Jeong H. Mechanical effect of process condition and abrasive concentration on material removal rate profile in copper chemical mechanical planarization[J]. Journal of Materials Processing Technology, 209, 1729-1735(2009).

[10] Zheng H F. Research on dynamic force and polishing temperature measurement of ultra-thin stainless steel substrate during chemical mechanical polishing[D], 31-32(2014).

[11] Lee C, Park J, Kinoshita M et al. Development of intelligent pad monitoring system and application to analysis of pressure distribution in chemical mechanical polishing process[J]. International Journal of Precision Engineering and Manufacturing, 15, 2005-2009(2014).

[12] Running C L, Sakaue H, Juliano T J. Hypersonic boundary-layer separation detection with pressure-sensitive paint for a cone at high angle of attack[J]. Experiments in Fluids, 60, 23(2019).

[13] Naddeo A, Califano R, Vink P. The effect of posture, pressure and load distribution on (dis)comfort perceived by students seated on school chairs[J]. International Journal on Interactive Design and Manufacturing (IJIDeM), 12, 1179-1188(2018).

[14] Liang C, Zhu D Q, Wang G L et al. Experimental study on tire-road dynamic contact pressure distribution using FTIR imaging[J]. International Journal of Automotive Technology, 22, 1305-1317(2021).

[15] Runnels S R, Eyman L M. Tribology analysis of chemical-mechanical polishing[J]. Journal of the Electrochemical Society, 141, 1698-1701(1994).

[16] Jiang X W, Long X W, Tan Z Q. A review of material removal mechanism in ultra-precision polishing of optical glass[J]. Chinese Journal of Lasers, 48, 0401014(2021).

[17] Lü Y S, Wang J, Zhang L Y et al. Effect of retaining ring on pressure distribution and profile of polishing wafer surface[J]. Optics and Precision Engineering, 16, 689-695(2008).

[18] Srinivasa-Murthy C, Wang D, Beaudoin S P et al. Stress distribution in chemical mechanical polishing[J]. Thin Solid Films, 308/309, 533-537(1997).

[19] Yang X J, Zhao L. Study on material deformation and edge effect during single crystal germanium polishing[J]. Journal of Plasticity Engineering, 27, 97-105(2020).

[20] Gray C. Detecting pad-wafer contact in CMP using dual emission laser induced fluorescence[D](2008).