[1] [1] KNECHTEL R. Glass frit bonding: An universal technology for wafer level encapsulation and packaging ［J］. Microsystem Technologies, 2005, 12: 63-68.

[2] [2] DU LI D, ZHAO ZH, FANG ZH, et al.. Wafer level hermetic packaging based［J］.Opt. Precision Eng., 2014, 22(11): 3044-3049.(in Chinese)

[3] [3] DOUGLAS S, SONBOL M, NADER N. Reliable vacuum packaging using nanogetters TM and glass frit bonding［J］.Proc. SPIE , 2004, 5343: 70-78.

[4] [4] EDDY D, SPARKS D. Application of MEMS technology in automotive sensors and actuators［J］. Proc.IEEE, 1998, 86(8): 1747.

[5] [5] WU G, XU D, SUN X, et al.. Wafer-level vacuum packaging for microsystems using glass frit bonding ［J］. Components, Packaging and Manufacturing Technology, IEEE Transactions on, 2013, 3: 1640-1646.

[6] [6] XU W, WANG Y CH, LUO L. Wafer-level hermetic package of MEM S by glass solder at low temperature［J］. Journal of Functional Materials and Devices, 2005, 11(3): 343-346. (in Chinese)

[7] [7] CHONG S C, ZHANG X, MOHANRAJ S, et al.. Effect of passivation on frit glass bonding method for wafer level hermetic sealing on MEMS devices ［C］. Electronics Packaging Technology, 2003 5th Conference (EPTC 2003): 307-310.

[8] [8] CHEN X, YAN P l, TANG J J, et al.. Application of WLP with barrier trench structure in precision screen printing technology by glass frit［C］. 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010: 71-73.

[9] [9] CHEN C Y, HUNG C H, JHONG J Y, et al.. Demonstration of wafer capping through glass frit bonding and its application on molded platform package ［C］. Microsystems, Packaging, Assembly and Circuits Technology, 2007: 177-180.

[10] [10] MASAYOSHI E.Wafer level packaging of MEMS［J］. J. Micromech. Microen., 2008, 18 : 1-13.

[11] [11] SUN F F. The investigation of process and analysis of thermal stress in wafer-level hermetic package of MEMS by glass frit［D］. Nanjing: Nanjing University of Science and Technology, 2010: 55-60. (in Chinese)

[12] [12] CHEN X, YAN P L, TANG J J, et al.. Development of wafer level glass frit bonding by using barrier trench technology and precision screen printing［J］. Microelectronic Engineering, 2012, 100: 6-11.

[13] [13] ZHAO Y ZH, YIN H R. Glass Technology［M］. Beijing: Chemical Industry Press, 2006: 236-246.

[14] [14] RUUD G, Beerkens C, JOHN S. Gas release and foam formation during melting and fining of glass［J］. J. Am. Ceram. Soc., 2006, 89(1): 24-35.

[15] [15] MATTHIAS E, JORG B. Determination of residual stress in glass frit bonded MEMS by Finite Element Analysis［C］. 5th. Int. Con6 on Thermal and Mechanical Simulation and Experiments in Micro-electronics and Micro-Systems, 2004, 407-412.

[16] [16] ZENG Y B, WANG L Y, GU D D, et al.. Application of ultrasonic technology to wet etching of silicon［J］.Opt. Precision Eng., 2009, 17(1): 1-6．(in Chinese)