Optics and Precision Engineering, Volume. 24, Issue 4, 780(2016)
Void suppression and micro composite regulation in glass frit bonding
An innovated pre-sintering process including three-step bubble removing procedure and a micro composite bonding structure containing two micro grooves and one micro block bulge were investigated to effectively suppress the formation of voids in a glass frit layer and to precisely control the bonding gap. The three-step bubble removing procedure includes glass liquid forming, bubble removal in vacuum and void filling-up in air, which effectively removes the bubbles and suppress the generation of micro voids in the intermediate bonding layer. The innovated pre-sintering process shows good repeatability and robustness. The inside and outside micro grooves of the micro composite bonding structure were designed to effectively control the flowing path of the redundant molten glass frit to prevent the sealed micro structure from being polluted. And the micro block bulge was invented to make the thickness of the glass frit be precisely equal to the height of the bulge. The bonding performance testing result shows that the scheme is simple and feasible. Both bonding strength and hermeticity are good. The bonding gap is controlled to be 10.1 μm , the bonding strength is 19.07 MPa, and the leak rate is less than 5×10-9 Pa·m3/s.
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LIU Yi-fang, WANG Ling-yun, SUN Dao-heng, ZHENG Jian-yi. Void suppression and micro composite regulation in glass frit bonding[J]. Optics and Precision Engineering, 2016, 24(4): 780
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Received: Nov. 12, 2015
Accepted: --
Published Online: Jun. 6, 2016
The Author Email: Yi-fang LIU (yfliu@xmu.edu.cn)