Acta Optica Sinica, Volume. 43, Issue 16, 1623004(2023)

Real-Time Ultraspectral Imaging Chip Based on Metasurfaces

Jiawei Yang1,2, Kaiyu Cui1,2、*, Jian Xiong1,2, Shijie Rao1,2, Xue Feng1,2, Fang Liu1,2, Wei Zhang1,2,3, and Yidong Huang1,2,3、**
Author Affiliations
  • 1Department of Electronic Engineering, Tsinghua University, Beijing 100084, China
  • 2Beijing National Research Center for Information Science and Technology (BNRist), Beijing 100084, China
  • 3Beijing Academy of Quantum Information Science, Beijing 100084, China
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    Figures & Tables(11)
    Classification of spectral imaging by acquisition methods[11]. (a) Scanning spectral imaging; (b) snapshot spectral imaging
    Principle of metasurface based spectral imaging. (a) Structure diagram of metasurface spectral imaging chip, including two parts of metasurface layer and CMOS image sensor; (b) principle of spectral reconstruction for a single metasurface microspectrometer; (c) principle of space division multiplexing of metasurface
    Design objective of metasurface units. (a) Projection of spectral lines at λk、λk+1 onto transmission spectra of metasurface units; (b) corresponding measurement vectors Ik、Ik+1 for spectral lines at λk、λk+1 are two columns of measurement matrix T without considering measurement noise
    World's first real-time ultraspectral imaging chip and its performance[17]. (a) Schematic diagram of chip structure; (b) reconstruction results of narrowband spectra using microspectrometer of chip; (c) center-wavelength error and linewidth error for results in (b); (d) reconstruction results of double-peak signal
    Ultraspectral imaging chip based on metasurfaces with freeform shaped meta-atoms[19]. (a) Schematic diagram of structure; (b) reconstruction results of double-peak signal
    Spectral imaging results for a standard colorboard and a plate of fruit using ultraspectral imaging chip based on metasurfaces with freeform shaped meta-atoms[19]. (a) Object picture of ultraspectral camera; (b) red, green, and blue (RGB) pseudo-color image of standard colorboard captured by a commercial spectral camera; (c) RGB pseudo-color image of standard colorboard reconstructed by ultraspectral camera; (d) reconstructed spectra (red lines) for 24 types of colors with spectra captured by commercial spectral camera as a reference (blue lines), in which fidelities for recovered spectra are marked in top right-hand corner; (e) spectral imaging results for a plate of fruit and spectral reconstruction results for sampling points
    Basic architecture of ADMM-net and reconstruction results of a standard colorboard using ADMM-net[26]. (a) Network structure of ADMM-net; (b) spectral image reconstruction results of a standard colorboard using ADMM-net
    Real-time brain spectral imaging results for a rat using world's first real-time superspectral imaging chip[17]. (a) Spectral imaging results; (b) object picture of spectral camera; (c) spectral signals of different regions; (d) changes of spectral signals of HbO and HbR over time in vascular areas; (e) changes of spectral signals of HbO and HbR over time in non-vascular areas
    Snapshot spectral measurement results of living faces and common camouflage materials [10]. (a) Live face; (b) paper mask; (c) silicone mask; (d) raw silicone material
    Real-time spectral imaging results of an outdoor driving scene[26]
    • Table 1. Running time of different spectral imaging methods

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      Table 1. Running time of different spectral imaging methods

      MethodLine scanningADMM-netGAP-TVλ-netCVX
      Data cube size256×256×26256×256×601256×256×26
      Running time /s~60

      1.72 @CPU

      0.018 @GPU

      110 @CPU

      2.44 @CPU

      0.095 @GPU

      7767 @CPU4854 @CPU
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    Jiawei Yang, Kaiyu Cui, Jian Xiong, Shijie Rao, Xue Feng, Fang Liu, Wei Zhang, Yidong Huang. Real-Time Ultraspectral Imaging Chip Based on Metasurfaces[J]. Acta Optica Sinica, 2023, 43(16): 1623004

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    Paper Information

    Category: Optical Devices

    Received: May. 4, 2023

    Accepted: Jun. 8, 2023

    Published Online: Aug. 1, 2023

    The Author Email: Cui Kaiyu (kaiyucui@tsinghua.edu.cn), Huang Yidong (yidonghuang@tsinghua.edu.cn)

    DOI:10.3788/AOS230901

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