Infrared and Laser Engineering, Volume. 49, Issue 8, 20190532(2020)

System design for beam coupling and alignment monitoring of chip spectrometer

Zhiying Liu, Xin Jiang, Mingyu Li, and Wenbo Jia
Author Affiliations
  • School of Opto-electronic Engineering, Changchun University of Science and Technology, Changchun 130022, China
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    Aiming at the problem of the beam coupling and alignment monitoring of the chip spectrometer, an integrated optical system was proposed for avoiding the wear of the receiving end at chip spectrometer and the shielding of the optical fiber. The system consisted of a front coupling system, a rear monitor system and a composite sharing system. The composite sharing system needed to cooperate with the front coupling system and the rear monitor system to complete the beam coupling and alignment monitoring functions respectively. The final system was designed by multiple combinations, a coupling system and a monitoring system were designed for a 6 μm incident fiber and a 20 μm×20 μm chip spectrometer receiving end at (1 550±50) nm. The energy analysis of the coupled system was performed by LightTools. The coupling efficiency was 0.733. The final system has a simple structure and can perform beam coupling and alignment monitoring at the same time, which provides a new method for the beam coupling and monitoring of chip spectrometers.

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    Zhiying Liu, Xin Jiang, Mingyu Li, Wenbo Jia. System design for beam coupling and alignment monitoring of chip spectrometer[J]. Infrared and Laser Engineering, 2020, 49(8): 20190532

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    Paper Information

    Category: 光电测量

    Received: Dec. 5, 2019

    Accepted: --

    Published Online: Dec. 31, 2020

    The Author Email:

    DOI:10.3788/IRLA20190532

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