[1] [1] Matsumoto T, Wang D, Namihira T, et al. IEEE Transaction Plasma Sci., 2010, 38(10): 2639.

[2] [2] Lin W F, Zhang B, Hou W H, et al. J. Eviron Sci-China, 2009, 21(6): 790.

[3] [3] Rajanikanth B S, Sinha D, Emmanuel P. Plasma Sci. Technol, 2008, 10(3): 307.

[4] [4] Li J, Shang K F, Wu Y, et al. J. Electrostat, 2007, 65(4): 228.

[5] [5] Chang M B, Lee H M, Wu F L, et al. J. Air Waste Manage, 2004, 54(8): 941.

[6] [6] Julien D, Astrid B, Francoise C, et al. Chemphyschem, 2010, 11(18): 4002.

[7] [7] Huang H B, Ye D Q, Leung Dennis Y C. J. Environ. Eng-ASCE, 2010, 136(11): 1231.

[8] [8] Liao X B, Guo Y F, He J H, et al. Plasma Chem. Plasma Processing, 2010, 30(6): 841.

[9] [9] Babayan S E, Ding G, Hicks R F. Plasma Chem. Plasma Processing, 2001, 21: 505.

[10] [10] Hazama H, Fujiwara M, Tanimoto M. Chem. Phys. Lett., 2000, 323: 542.

[11] [11] Aragon C, Aguilera J A. Spectrochim Acta B, 2008, 63(9): 893.

[13] [13] Miyanaga S, Kaneko T, Ishida H, et al. Thin Solid Films, 2010, 518(13): 3509.

[14] [14] Yang X, Moravej M, Nowling G R, et al. Plasma Sources Sci. Technol., 2005, 14: 314.

[15] [15] Laux C O, Kruger C H, Zare R N. Plasma Sources Sci. Technol., 2003, 12(2): 125.