[1] E. Menard, K. J. Lee, D.-Y. Khang, R. G. Nuzzo, J. A. Rogers. A printable form of silicon for high performance thin film transistors on plastic substrates. Appl. Phys. Lett., 84, 5398-5400(2004).

[2] M. A. Meitl, Z.-T. Zhu, V. Kumar, K. J. Lee, X. Feng, Y. Y. Huang, I. Adesida, R. G. Nuzzo, J. A. Rogers. Transfer printing by kinetic control of adhesion to an elastomeric stamp. Nat. Mater., 5, 33-38(2006).

[3] X. Sheng, C. A. Bower, S. Bonafede, J. Wilson, B. Fisher, M. Meitl, H. Yuen, S. Wang, L. Shen, A. R. Banks, C. J. Corcoran, R. G. Nuzzo, S. Burroughs, J. A. Rogers. Printing-based assembly of quadruple-junction four-terminal microscale solar cells and their use in high-efficiency modules. Nat. Mater., 13, 593-598(2014).

[4] H. Kim, E. Brueckner, J. Song, Y. Li, S. Kim, C. Lu, J. Sulking, K. Choquette, Y. Huang, R. G. Nuzzo, J. A. Rogers. Unusual strategies for using indium gallium nitride grown on silicon (111) for solid-state lighting. Proc. Natl. Acad. Sci. USA, 108, 10072-10077(2011).

[5] J. Justice, C. A. Bower, M. Meitl, M. B. Mooney, M. A. Gubbins, B. Corbett. Wafer scale integration of III V lasers on silicon using transfer printing of epitaxial layers. Nat. Photonics, 6, 612-616(2012).

[6] R. Loi, J. O’Callaghan, B. Roycroft, C. Robert, A. Fecioru, A. J. Trindade, A. Gocalinska, E. Pelucchi, C. A. Bower, B. Corbett. Transfer printing of AlGaInAs/InP etched facet lasers to Si substrates. IEEE Photon. J., 8, 1-10(2016).

[7] D. H. Kim, N. Lu, R. Ghaffari, J. A. Rogers. Inorganic semiconductor nanomaterials for flexible and stretchable bio-integrated electronics. NPG Asia Mater., 4, e15(2012).

[8] S.-I. Park, Y. Xiong, R.-H. Kim, P. Elvikis, M. Meitl, D.-H. Kim, J. Wu, J. Yoon, C.-J. Yu, Z. Liu, Y. Huang, K.-C. Hwang, P. Ferreira, X. Li, K. Choquette, J. A. Rogers. Printed assemblies of inorganic light-emitting diodes for deformable and semitransparent displays. Science, 325, 977-981(2009).

[9] C. A. Bower, E. Menard, S. Bonafede, J. W. Hamer, R. S. Cok. Transfer-printed microscale integrated circuits for high performance display backplanes. IEEE Trans. Compon. Packag. Manuf., 1, 1916-1922(2011).

[10] M. Meitl, E. Radauscher, S. Bonafede, D. Gomez, T. Moore, C. Prevatte, B. Raymond, B. Fisher, K. Ghosal, A. Fecioru, A. J. Trindade, D. Kneeburg, C. A. Bower. 55‐1: Invited paper: passive matrix displays with transfer‐printed microscale inorganic LEDs. SID Symp. Dig. Tech. Pap., 47, 743-746(2016).

[11] A. Carlson, H.-J. Kim-Lee, J. Wu, P. Elvikis, H. Cheng, A. Kovalsky, S. Elgan, Q. Yu, P. M. Ferreira, Y. Huang, K. T. Turner, J. A. Rogers. Shear-enhanced adhesiveless transfer printing for use in deterministic materials assembly. Appl. Phys. Lett., 98, 264104(2011).

[12] A. Carlson, S. Wang, P. Elvikis, P. M. Ferreira, Y. Huang, J. A. Rogers. Active, programmable elastomeric surfaces with tunable adhesion for deterministic assembly by transfer printing. Adv. Funct. Mater., 22, 4476-4484(2012).

[13] D. Gomez, K. Ghosal, M. A. Meitl, S. Bonafede, C. Prevatte, T. Moore, B. Raymond, D. Kneeburg, A. Fecioru, A. J. Trindade, C. A. Bower. Process capability and elastomer stamp lifetime in micro transfer printing. Proceedings of the 66th IEEE Electronic Components and Technology Conference (ECTC), 680-687(2016).

[14] C. A. Bower, D. Gomez, K. Lucht, B. Cox, D. Kneeburg. Transfer-printed integrated circuits for display backplanes. Proceedings of International Display Workshop, 1203-1206(2010).

[15] J. Yoon, S. M. Lee, D. Kang, M. A. Meitl, C. A. Bower, J. A. Rogers. Heterogeneously integrated optoelectronic devices enabled by micro‐transfer printing. Adv. Opt. Mater., 3, 1313-1335(2015).

[16] R. H. Kim, S. Kim, Y. M. Song, H. Jeong, T. I. Kim, J. Lee, X. Li, K. D. Choquette, J. A. Rogers. Flexible vertical light emitting diodes. Small, 8, 3123-3128(2012).

[17] T. I. Kim, Y. H. Jung, J. Song, D. Kim, Y. Li, H. S. Kim, I. S. Song, J. J. Wierer, H. A. Pao, Y. Huang, J. A. Rogers. High‐efficiency, microscale GaN light‐emitting diodes and their thermal properties on unusual substrates. Small, 8, 1643-1649(2012).

[18] C. Prevatte, I. Guven, K. Ghosal, D. Gomez, T. Moore, S. Bonafede, B. Raymond, A. J. Trindade, A. Fecioru, D. Kneeburg, M. A. Meitl, C. A. Bower. Pressure activated interconnection of micro transfer printed components. Appl. Phys. Lett., 108, 203503(2016).

[19] J. A. Castellano. Handbook of Display Technology(2012).

[20] R. Street. Technology and Applications of Amorphous Silicon, 37(2013).

[21] J. F. Tremblay. The rise of OLED displays. Chem. Eng. News, 94, 29-34(2016).

[22]

[23] M. Lueck, A. Huffman, P. Hines, J. Lannon, S. Bonafede, A. J. Trindade, C. A. Bower. Fan-out packaging of microdevices assembled using micro-transfer-printing. Proceedings of the 66th IEEE Electronic Components and Technology Conference (ECTC), 37-42(2016).