Optics and Precision Engineering, Volume. 20, Issue 6, 1250(2012)

Application of ultrasonic stress relief technology to microinjection mold fabrication

DU Li-qun1...2, LI Cheng-bin2,*, LI Yong-hui2 and YU Tong-min1 |Show fewer author(s)
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  • 1[in Chinese]
  • 2[in Chinese]
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    References(18)

    [1] [1] THIAN S, TANG Y, FUH J Y H, et al.. Formation of micromoulds via UV lithography of SU8 photoresist and nickel electrodeposition [C]. Proceedings of the Institution of Mechanical Engineers, UK: Mechanical Engineering Publications Ltd, 2006:329-333.

    [2] [2] NAPHON P, KHONSEUR O. Study on the convective heat transfer and pressure drop in the micro-channel heat sink [J]. International Communications in Heat and Mass Transfer, 2009,3(1)6:39-44.

    [3] [3] LORENZ H, DESPONT M, VETTIGER P, et al.. Fabrication of photoplastic high-aspect ratio microparts and micromolds using SU-8 UV resist [J]. Microsystem Technologies, 1998,4(3):143-146.

    [5] [5] CHAN-PARK M B, ZHANG J, YAN Y H, et al.. Fabrication of large SU-8 mold with high aspect ratio microchannels by UV exposure dose reduction [J]. Sensors and Actuators B, 2004,101:175-182.

    [6] [6] ZHUANG J, YU T M, WANG M J, et al.. Fabrication of microchannel cavity using UV-LIGA process [J]. Journal of Harbin Institute of Technology, 2009,41(5):106-109. (in Chinese)

    [7] [7] DU L Q, WANG Q J, ZHANG X L. Reduction of internal stress in SU-8 photoresist layer by ultrasonic treatment [J]. Science China Technological Sciences, 2010, 53(11):3006-3113.

    [8] [8] ZIZZARI A, ARIMA V, ZACHEO A, et al.. Fabrication of SU-8 microreactors for radiopharmaceutical production [J]. Microelectronic Engineering, 2011,88(8):1664-1667.

    [12] [12] CHANG H K, KIM Y K. UV-LIGA process for high aspect ratio structure using stress barrier and C-shaped etch hole [J]. Sensors and Actuators A,2000,84(3):342-350.

    [13] [13] DU L Q, WANG Q J, ZHANG X L. Optimization of ultrasonic stress relief process parameters based on fuzzy neural network [J]. Journal of Micro-Nano Mechatronics,2011,6:39-46.

    [14] [14] DU L Q, WANG Y, WANG Q J, et al.. Experimental study of ultrasonic stress relief used in SU-8 photoresist [J]. Journal of Dalian University of Technology, 2010,50(6):907-911. (in Chinese)

    [15] [15] HAMMACHER J, FUELLE A, FLAEMIG J, et al.. Stress engineering and mechanical properties of SU-8 layers for mechanical application [J]. Microsystem Technologies, 2008,14:1515-1523.

    [16] [16] DU L Q, WANG Q J. Experimental study on ultrasonic stress relief for cured SU-8 photoresist layer [J]. Microelectronic Engineering, 2010,87(12):2555-2560.

    [17] [17] DU L Q, QIN J, LIU H J, et al.. Study on Process of Microinjection Metal Mold Based on UV-LIGA Technology [J]. Microfabrication Technology, 2006,(5):51-54. (in Chinese)

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    CLP Journals

    [1] DU Li-qun, BAO Qi-lei, ZHAO Ming, WANG Ao-an. Fabrication of metal micro-grating with high aspect ratio on metal substrate[J]. Optics and Precision Engineering, 2015, 23(3): 700

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    DU Li-qun, LI Cheng-bin, LI Yong-hui, YU Tong-min. Application of ultrasonic stress relief technology to microinjection mold fabrication[J]. Optics and Precision Engineering, 2012, 20(6): 1250

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    Paper Information

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    Received: Feb. 3, 2012

    Accepted: --

    Published Online: Jun. 25, 2012

    The Author Email: Cheng-bin LI (licb_simon@163.com)

    DOI:10.3788/ope.20122006.1250

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