Infrared and Laser Engineering, Volume. 44, Issue S, 178(2015)
Pulsed laser diode packaging with epoxy resin with integrated driver stage
[1] [1] Luo Daxin, Zhao Baiqin. Laser beam shaping and packaging system[C]//Proceedings of SPIE-The International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies,2012, 8416(6): 1010-1015.
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Ji Yafei, Luo Daxin, Zhao Baiqin. Pulsed laser diode packaging with epoxy resin with integrated driver stage[J]. Infrared and Laser Engineering, 2015, 44(S): 178