Infrared and Laser Engineering, Volume. 49, Issue 9, 20200312(2020)
Design of information processing system for photoelectric seeker
Figures & Tables(7)
Fig. 1. Logical composition diagram of a typical photoelectric seeker system
Fig. 2. Logical composition diagram of typical uncooled infrared detection imaging components
Fig. 5. Logic composition diagram of a typical laser information processor
Fig. 6. Logic composition diagram of typical integrated miniaturized information processor
Table 1.
Feature summary of integrated miniaturized information processor
集成小型化信息处理机设计指标
View tableView in ArticleTable 1.
Feature summary of integrated miniaturized information processor
集成小型化信息处理机设计指标
Performance Device reference Remarks Computing performance 8 TMS320C66x DSP Core Subsystems (C66x CorePacs) 4 ARM® Cortex® -A15 MPCoreTM Processors DSP: 1.2 GHz×8=9.6 GHz ARM: 1.4 GHz×4=5.6 GHz Integer (Instructions) 19600 DMIPS Fixed Point 307.2 GMACS Floating Point 198.4 GFLOPS 66AK2Hxx TI DSP DSP+ARM Max 3528 DSP Slices 6.3 TeraMACs of DSP compute performance XCKUxxP XILINX FPGA UltraScale+ Logic timing Up to 1.2M system logic cells Up to 11 CMTs Memory 8 MB Local L2 Cache 6 MB Multicore Shared Memory (SRAM) On DSP chip 4 MB Local L2 Cache On ARM chip 2 GBytes DDR3 2 Gbits NOR FLASH MT41K512M16 MT25QU02GcBB External extension Signal acquisition 16 Bits, Up to 500 kSPS, 8 channels, ±20.48 V maximum ADAS3023 Interface expansion CameraLink, PAL, RS422, CAN Standard interface and PWM GPIO control signals DSP, ARM & FPGA Consumption Input：+5V, consumption about 30 W With heat dissipation Size Less than ø 150 mmWeight Less than 500 g Contains structural parts
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Xianzhi Chen, Zhenbao Luo, Xu Yang, Tao Chen, Jingtong Zhao. Design of information processing system for photoelectric seeker[J]. Infrared and Laser Engineering, 2020, 49(9): 20200312
Paper Information
Category: Photoelectric measurement
Received: Aug. 25, 2020
Accepted: --
Published Online: Jan. 4, 2021
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